AMD EPYC 4464P vs Intel Xeon w3-2425 Full Specs

Summary

12 Cores 24 Threads 3.7GHz	6 Cores 12 Threads 3GHz
TDP 105W	TDP 130W
Bandwidth 83.2GB/s DDR5	Bandwidth 140.8GB/s DDR5
iGPU Radeon 2CU 2200MHz RDNA 2	iGPU 0
Peak·FP32·FP16 1.13 TFLOPSFP16	Peak·FP32·FP16 -
Socket AM5	Socket LGA 4677

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 TDP

EPYC 4464P2,893

x1.61

Xeon w3-24251,799

x1

Show Top Score

Core Config

12 Cores	6 Cores
24 Threads	12 Threads

Clocks

Base Clock 3.7GHz	Base Clock 3GHz
Boost Clock 5.4GHz	Boost Clock 4.4GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB	L1i 32KB
L1d 32KB	L1d 48KB
L2 1MB	L2 2MB
L3 32MB	L3 15MB

Memory

Type DDR5	Type DDR5
Max Memory 192GB	Max Memory 2.05TB
ECC Yes	ECC Yes
Channels 2	Channels 4
Bus Width 128-bit	Bus Width 256-bit
Speed 5200MT/s	Speed 4400MT/s
Bandwidth 83.2GB/s	Bandwidth 140.8GB/s
Bandwidth Calculator Channels Transfer Rate5200MT/s Calculated Bandwidth 83.2GB/s	Bandwidth Calculator Channels Transfer Rate4400MT/s Calculated Bandwidth 140.8GB/s

Power & Thermals

TDP 105W	TDP 130W
cTDP-down 88W	cTDP-down -
cTDP-up 142W	cTDP-up -
Peak Power -	Peak Power 156W
Max Operating Temp 95°C Max	Max Operating Temp 83°C Max
T-Case 61°C Max	T-Case 64°C Max
Included Cooler -	Included Cooler 0

Chipset Bus

Bus Type PCIe	Bus Type DMI
Bus Config 4 lanes	Bus Config 8 lanes
Bus Speed 32GT/s	Bus Speed 8GT/s
Bus Bandwidth 16GB/s	Bus Bandwidth 8GB/s

Expansion

PCIe PCIe 5.0 x24 94.5GB/sBandwidth

PCIe PCIe 5.0 x64 252GB/sBandwidth

iGPU

iGPU Radeon 2CU 2200MHz RDNA 2	iGPU 0
Shaders 128	Shaders -
Boost Clock 2.2GHz	Boost Clock -
Peak·FP32·FP16 1.13 TFLOPSFP16	Peak·FP32·FP16 -

NPU

NPU Model -

NPU Model DL Boost

Chip

Manufacturer AMD	Manufacturer Intel
ISA x86-64	ISA x86-64
Architecture Zen 4	Architecture Sapphire Rapids
Family EPYC 4004	Family Xeon 4
Branding	Branding
Codename Raphael DurangoDie Raphael 2CCDVariant -	Codename Sapphire Rapids-WS - Sapphire Rapids-MCCVariant Golden CoveP-Core
Market Segment Workstation	Market Segment Workstation
Release Date May 21, 2024	Release Date Jan 10, 2023

Fabrication

Foundry TSMC	Foundry Intel
Other Foundries TSMCIO	Other Foundries -
Fabrication Node N5 N6IO	Fabrication Node Intel 7 -
Die Size 71mm² 122mm²IO	Die Size 770mm² -
Transistor Count 6.6 Billion 3.4 BillionIO	Transistor Count 53.9 Billion -
Transistor Density 93 MTr/mm² 28 MTr/mm²IO	Transistor Density 70 MTr/mm² -

Images

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