AMD Ryzen 3 PRO 5450U vs Intel Core i3-L13G4 Full Specs

Summary

4 Cores 8 Threads 2.6GHz	5 Cores(1P+4E) 6 Threads(2P+4E) 800MHz
TDP 15W	TDP -
Bandwidth 68.3GB/s LPDDR4X·DDR4	Bandwidth 34.1GB/s LPDDR4X
iGPU Radeon Vega 6 1600MHz	iGPU UHD 48EU 500MHz Gen 11
Peak·FP32·FP16 2.46 TFLOPSFP16	Peak·FP32·FP16 768 GFLOPSFP16
Socket FP6	Socket CSP 1016

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 TDP

Ryzen 3 PRO 5450U1,618

x2.50

Core i3-L13G4646

x1

Show Top Score

Core Config

4 Cores 4P -	5 Cores 1P 4E
8 Threads 8P -	6 Threads 2P 4E

Clocks

Base Clock 2.6GHz	Base Clock 800MHz
Boost Clock 4GHz	Boost Clock 2.8GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB P -	L1i 32KB P 32KB E
L1d 32KB P -	L1d 48KB P 32KB E
L2 512KB P -	L2 512KB P 1.5MB E shared
L3 8MB	L3 8MB

Memory

Type LPDDR4X·DDR4	Type LPDDR4X
Max Memory 32GB	Max Memory 8GB
ECC No	ECC No
Channels 2	Channels 1
Bus Width 128-bit	Bus Width 64-bit
Speed 4266MT/s	Speed 4266MT/s
Bandwidth 68.3GB/s	Bandwidth 34.1GB/s
Bandwidth Calculator Channels Transfer Rate4266MT/s Calculated Bandwidth 68.3GB/s	Bandwidth Calculator Channels Transfer Rate4266MT/s Calculated Bandwidth 34.1GB/s

Power & Thermals

TDP 15W	TDP -
cTDP-down 10W	cTDP-down -
cTDP-up 25W	cTDP-up -
Max Operating Temp 105°C Max	Max Operating Temp 100°C Max
Included Cooler -	Included Cooler 0

Chipset Bus

Bus Type PCIe	Bus Type OPI
Bus Config 4 lanes	Bus Config 4 lanes
Bus Speed 8GT/s	Bus Speed 4GT/s
Bus Bandwidth 4GB/s	Bus Bandwidth 2GB/s

Expansion

PCIe PCIe 3.0 x16 15.8GB/sBandwidth

PCIe PCIe 3.0 x6 5.9GB/sBandwidth

iGPU

iGPU Radeon Vega 6 1600MHz	iGPU UHD 48EU 500MHz Gen 11
Shaders 384	Shaders 384
Boost Clock 1.6GHz	Boost Clock 500MHz
Peak·FP32·FP16 2.46 TFLOPSFP16	Peak·FP32·FP16 768 GFLOPSFP16

Chip

Manufacturer AMD	Manufacturer Intel
ISA x86-64	ISA x86-64
Architecture Zen 3	Architecture Lakefield
Family Ryzen 5000	Family Core 11th Gen
Branding	Branding
Codename Cezanne - -	Codename Lakefield Sunny CoveP-Core TremontE-Core
Market Segment Laptop	Market Segment Laptop
Release Date Mar 16, 2021	Release Date May 28, 2020

Fabrication

Foundry TSMC	Foundry Intel
Other Foundries -	Other Foundries IntelIO
Fabrication Node N7 -	Fabrication Node 10nm+ 22nmIO
Die Size 180mm² -	Die Size 82mm² 92mm²IO
Transistor Count 10.7 Billion -	Transistor Count 4 Billion 650 MillionIO
Transistor Density 59 MTr/mm² -	Transistor Density 49 MTr/mm² 7 MTr/mm²IO

Images

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Used In

Laptops -

Laptops Galaxy Book S(Mid 2020)

Competitors

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