CPUs

AMD Ryzen 3 PRO 8300G vs Intel Core i5-4670R Full Specs

4 Cores(1P+3E)
8 Threads(2P+6E)
4GHz
4 Cores
4 Threads
3GHz
TDP
65W
TDP
65W
Bandwidth
83.2GB/s
DDR5
Bandwidth
25.6GB/s
·
iGPU
iGPU
··
2.66 TFLOPSFP16
··
832 GFLOPSFP32
Socket
Socket

Ryzen 3 PRO 8300GRyzen 3 PRO 8300G2,340
x2.50
Core i5-4670RCore i5-4670R935
x1

4 Cores
1P
3E
4 Cores
4P
-
8 Threads
2P
6E
4 Threads
4P
-

Base Clock
4GHz
Base Clock
3GHz
Boost Clock
4.9GHz
Boost Clock
3.7GHz
Overclocking
Unlocked
Overclocking
Locked

L1i
32KB P
L1i
32KB P
L1d
32KB P
L1d
32KB P
L2
1MB P
L2
256KB P
L3
8MB
L3
4MB
L4 Cache
-
L4 Cache
128MB

Type
DDR5
Type
·
Max Memory
256GB
Max Memory
32GB
ECC
No
ECC
No
Channels
2
Channels
2
Bus Width
128-bit
Bus Width
128-bit
Speed
5200MT/s
Speed
1600MT/s
Bandwidth
83.2GB/s
Bandwidth
25.6GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
83.2GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
25.6GB/s

TDP
65W
TDP
65W
cTDP-down
45W
cTDP-down
-
Max Operating Temp
95°C Max
Max Operating Temp
-

Bus Type
PCIe
Bus Type
DMI
Bus Config
4 lanes
Bus Config
4 lanes
Bus Speed
16GT/s
Bus Speed
5GT/s
Bus Bandwidth
8GB/s
Bus Bandwidth
2.5GB/s

PCIe
PCIe 4.0 x10
19.7GB/sBandwidth
PCIe
PCIe 3.0 x16
15.8GB/sBandwidth

iGPU
iGPU
Shaders
256
Shaders
320
Boost Clock
2.6GHz
Boost Clock
1.3GHz
··
2.66 TFLOPSFP16
··
832 GFLOPSFP32

Manufacturer
Manufacturer
ISA
x86-64
ISA
x86-64
Architecture
Architecture
Family
Family
Branding
Ryzen 3 2024 branding
Branding
Core i5 2013 branding
Codename
Phoenix 2
Zen 4P-Core
Zen 4cE-Core
Codename
Crystalwell
-
-
Market Segment
Desktop
Market Segment
Desktop
Release Date
Apr 16, 2024
Release Date
Jun 1, 2013

Foundry
TSMC
Foundry
Intel
Other Foundries
-
Other Foundries
InteleDRAM
Fabrication Node
N4
-
Fabrication Node
22nm
22nmeDRAM
Die Size
137mm²
-
Die Size
260mm²
77mm²eDRAM
Transistor Count
20.9 Billion
Transistor Count
1.7 Billion
Transistor Density
153 MTr/mm²
Transistor Density
7 MTr/mm²

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