AMD Ryzen 3 PRO 8300GE vs Intel Core i5-4570S Full Specs

Summary

4 Cores(1P+3E) 8 Threads(2P+6E) 3.5GHz	4 Cores 4 Threads 2.9GHz
TDP 35W	TDP 65W
Bandwidth 83.2GB/s DDR5	Bandwidth 25.6GB/s DDR3·DDR3L
iGPU Radeon 740M 2600MHz	iGPU HD 4600 1150MHz
Peak·FP32·FP16 2.66 TFLOPSFP16	Peak·FP32·FP16 368 GFLOPSFP32
Socket AM5	Socket LGA 1150

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi E-Core Boost Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 TDP

Ryzen 3 PRO 8300GE2,250

x1.99

Core i5-4570S1,131

x1

Show Top Score

Core Config

4 Cores 1P 3E	4 Cores 4P -
8 Threads 2P 6E	4 Threads 4P -

Clocks

Base Clock 3.5GHz	Base Clock 2.9GHz
Boost Clock 4.9GHz	Boost Clock 3.6GHz
Overclocking Unlocked	Overclocking Locked

Cache

L1i 32KB P	L1i 32KB P
L1d 32KB P	L1d 32KB P
L2 1MB P	L2 256KB P
L3 8MB	L3 6MB

Memory

Type DDR5	Type DDR3·DDR3L
Max Memory 256GB	Max Memory 32GB
ECC No	ECC No
Channels 2	Channels 2
Bus Width 128-bit	Bus Width 128-bit
Speed 5200MT/s	Speed 1600MT/s
Bandwidth 83.2GB/s	Bandwidth 25.6GB/s
Bandwidth Calculator Channels Transfer Rate5200MT/s Calculated Bandwidth 83.2GB/s	Bandwidth Calculator Channels Transfer Rate1600MT/s Calculated Bandwidth 25.6GB/s

Power & Thermals

TDP 35W	TDP 65W
Max Operating Temp 95°C Max	Max Operating Temp -
T-Case -	T-Case 71.35°C Max

Chipset Bus

Bus Type PCIe	Bus Type DMI
Bus Config 4 lanes	Bus Config 4 lanes
Bus Speed 16GT/s	Bus Speed 5GT/s
Bus Bandwidth 8GB/s	Bus Bandwidth 2.5GB/s

Expansion

PCIe PCIe 4.0 x10 19.7GB/sBandwidth

PCIe PCIe 3.0 x16 15.8GB/sBandwidth

iGPU

iGPU Radeon 740M 2600MHz	iGPU HD 4600 1150MHz
Shaders 256	Shaders 160
Boost Clock 2.6GHz	Boost Clock 1.15GHz
Peak·FP32·FP16 2.66 TFLOPSFP16	Peak·FP32·FP16 368 GFLOPSFP32

Chip

Manufacturer AMD	Manufacturer Intel
ISA x86-64	ISA x86-64
Architecture Zen 4	Architecture Haswell
Family Ryzen 8000	Family Core 4th Gen
Branding	Branding
Codename Phoenix 2 - Zen 4P-Core Zen 4cE-Core	Codename Devil's Canyon Haswell-4C-GT2Variant - -
Market Segment Desktop	Market Segment Desktop
Release Date Apr 16, 2024	Release Date Jun 1, 2013

Fabrication

Foundry TSMC	Foundry Intel
Fabrication Node N4	Fabrication Node 22nm
Die Size 137mm²	Die Size 177mm²
Transistor Count 20.9 Billion	Transistor Count 1.4 Billion
Transistor Density 153 MTr/mm²	Transistor Density 8 MTr/mm²

Images

No images available

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Used In

All-in-Ones -

All-in-Ones iMac 21.5(Late 2013)

Competitors

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IntelCore i5-4570S vs CPU AMDRyzen 5 8400F IntelCore i5-4570S vs CPU AMDEPYC 4124P IntelCore i5-4570S vs CPU AMDRyzen 3 PRO 8300G Show 12 more