AMD Ryzen AI 7 PRO 350 vs AMD Ryzen AI 9 HX 370 Full Specs

Summary

8 Cores(4P+4E) 16 Threads(8P+8E) 2GHz	12 Cores(4P+8E) 24 Threads(8P+16E) 2GHz
TDP 28W	TDP 28W
Bandwidth 128GB/s LPDDR5X·DDR5	Bandwidth 128GB/s LPDDR5X·DDR5
iGPU Radeon 860M 3000MHz	iGPU Radeon 890M 2900MHz
Peak·FP32·FP16 4.61 TFLOPSFP16	Peak·FP32·FP16 11.88 TFLOPSFP16
Socket FP8	Socket FP8

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Ryzen AI 7 PRO 350-

-

Ryzen AI 9 HX 3702,900

x1

Show Top Score

Core Config

8 Cores 4P 4E	12 Cores 4P 8E
16 Threads 8P 8E	24 Threads 8P 16E

Clocks

Base Clock 2GHz	Base Clock 2GHz
Boost Clock 5GHz	Boost Clock 5.1GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB P	L1i 32KB P
L1d 48KB P	L1d 48KB P
L2 1MB P	L2 1MB P
L3 16MB	L3 24MB

Memory

Type LPDDR5X·DDR5	Type LPDDR5X·DDR5
Max Memory 256GB	Max Memory 256GB
ECC No	ECC No
Channels 2	Channels 2
Bus Width 128-bit	Bus Width 128-bit
Speed 8000MT/s	Speed 8000MT/s
Bandwidth 128GB/s	Bandwidth 128GB/s
Bandwidth Calculator Channels Transfer Rate8000MT/s Calculated Bandwidth 128GB/s	Bandwidth Calculator Channels Transfer Rate8000MT/s Calculated Bandwidth 128GB/s

Power & Thermals

TDP 28W	TDP 28W
cTDP-down 15W	cTDP-down 15W
cTDP-up 54W	cTDP-up 54W
Max Operating Temp 100°C Max	Max Operating Temp 100°C Max
Included Cooler 0	Included Cooler 0

Chipset Bus

Bus Type PCIe	Bus Type PCIe
Bus Config 4 lanes	Bus Config 4 lanes
Bus Speed 16GT/s	Bus Speed 16GT/s
Bus Bandwidth 8GB/s	Bus Bandwidth 8GB/s

Expansion

PCIe PCIe 4.0 x16 31.5GB/sBandwidth

PCIe PCIe 4.0 x16 31.5GB/sBandwidth

iGPU

iGPU Radeon 860M 3000MHz	iGPU Radeon 890M 2900MHz
Shaders 384	Shaders 1024
Boost Clock 3GHz	Boost Clock 2.9GHz
Peak·FP32·FP16 4.61 TFLOPSFP16	Peak·FP32·FP16 11.88 TFLOPSFP16

NPU

NPU Model XDNA 2	NPU Model XDNA 2
NPU Cores 32	NPU Cores 32
Performance 50 TOPSINT8	Performance 50 TOPSINT8

Chip

Manufacturer AMD	Manufacturer AMD
ISA x86-64	ISA x86-64
Architecture Zen 5	Architecture Zen 5
Family Ryzen AI 300	Family Ryzen AI 300
Branding	Branding
Codename Strix Point Zen 5P-Core Zen 5cE-Core	Codename Strix Point Zen 5P-Core Zen 5cE-Core
Market Segment Laptop	Market Segment Laptop
Release Date Jan 6, 2025	Release Date Jun 2, 2024

Fabrication

Foundry TSMC	Foundry TSMC
Fabrication Node N4P	Fabrication Node N4P
Die Size 233mm²	Die Size 233mm²
Transistor Count 28 Billion	Transistor Count 28 Billion
Transistor Density 120 MTr/mm²	Transistor Density 120 MTr/mm²

Images

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Used In

Laptops -

Laptops Blade 16(Early 2025)Framework 13(Early 2025)

Competitors

AMDRyzen AI 7 PRO 350 vs CPU AMDRyzen AI 7 350 AMDRyzen AI 7 PRO 350 vs CPU AMDRyzen 9 270 AMDRyzen AI 7 PRO 350 vs CPU AMDRyzen 7 260 Show 12 more

AMDRyzen AI 9 HX 370 vs CPU AMDRyzen AI 7 350 AMDRyzen AI 9 HX 370 vs CPU AMDRyzen AI Max 390 AMDRyzen AI 9 HX 370 vs CPU AMDRyzen 9 270 Show 12 more