AMD Ryzen AI 9 365 vs Apple M4 Max (16C40G) Full Specs

Summary

10 Cores(4P+6E) 20 Threads(8P+12E) 2GHz	16 Cores(12P+4E) 16 Threads(12P+4E) 4.51GHz
TDP 28W	TDP 140W
Bandwidth 128GB/s LPDDR5X·DDR5	Bandwidth 546.1GB/s LPDDR5X
iGPU Radeon 880M 2900MHz	iGPU 40-Core M4 Max
Peak·FP32·FP16 8.91 TFLOPSFP16	Peak·FP32·FP16 16.16 TFLOPSFP16
Socket FP8	Socket -

Core Config

10 Cores 4P 6E	16 Cores 12P 4E
20 Threads 8P 12E	16 Threads 12P 4E

Clocks

Base Clock 2GHz	Base Clock 4.51GHz
Boost Clock 5GHz	Boost Clock -
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB P -	L1i 192KB P 128KB E
L1d 48KB P -	L1d 128KB P 64KB E
L2 1MB P - -	L2 32MB P shared 4MB E shared
L3 24MB	L3 -
SLC Cache -	SLC Cache 48MB

Memory

Type LPDDR5X·DDR5	Type LPDDR5X
Max Memory 256GB	Max Memory 128GB
ECC No	ECC No
Channels 2	Channels 4
Bus Width 128-bit	Bus Width 512-bit
Speed 8000MT/s	Speed 8533MT/s
Bandwidth 128GB/s	Bandwidth 546.1GB/s
Bandwidth Calculator Channels Transfer Rate8000MT/s UC·Spec·OC 128GB/s	Bandwidth Calculator Channels Transfer Rate8533MT/s UC·Spec·OC 546.1GB/s

Power & Thermals

TDP 28W	TDP 140W
cTDP-down 15W	cTDP-down -
cTDP-up 54W	cTDP-up -
Max Operating Temp 100°C Max	Max Operating Temp 100°C Max
Included Cooler 0	Included Cooler -

Chipset Bus

Bus Type PCIe	Bus Type -
Bus Config 4 lanes	Bus Config -
Bus Speed 16GT/s	Bus Speed -
Bus Bandwidth 8GB/s	Bus Bandwidth -

Expansion

PCIe PCIe 4.0 x16 31.5GB/sBandwidth

PCIe PCIe 4.0 x16 31.5GB/sBandwidth

iGPU

iGPU Radeon 880M 2900MHz	iGPU 40-Core M4 Max
Shaders 768	Shaders 5120
Boost Clock 2.9GHz	Boost Clock 1.58GHz
Peak·FP32·FP16 8.91 TFLOPSFP16	Peak·FP32·FP16 16.16 TFLOPSFP16

NPU

NPU Model XDNA 2	NPU Model H16 Aether
NPU Cores 32	NPU Cores 16
NPU Clock -	NPU Clock 2.36GHz
Performance 50 TOPSINT8	Performance 38 TOPSINT8

Chip

Manufacturer AMD	Manufacturer Apple
ISA x86-64	ISA AArch64
Architecture Zen 5	Architecture Apple Silicon 14ARMv9.2-A
Family Ryzen AI 300	Family M Series
Branding	Branding
Codename Strix Point - Zen 5P-Core Zen 5cE-Core	Codename Brava M4 MaxVariant AS14PP-Core AS14EE-Core
Market Segment Laptop	Market Segment Desktop
Release Date Jun 2, 2024	Release Date Oct 30, 2024

Fabrication

Foundry TSMC	Foundry TSMC
Fabrication Node N4P	Fabrication Node N3E
Die Size 233mm²	Die Size 454mm²
Transistor Count 28 Billion	Transistor Count 76 Billion
Transistor Density 120 MTr/mm²	Transistor Density 167 MTr/mm²

Images

Used In

Laptops Blade 16(Early 2025)	Laptops MacBook Pro 14(M4 Max, Late 2024)MacBook Pro 16(M4 Max, Late 2024)
Desktops -	Desktops Mac Studio(M4 Max, Early 2025)

Competitors

AMDRyzen AI 9 365 vs CPU AMDRyzen AI 9 HX 370 AMDRyzen AI 9 365 vs CPU AMDRyzen AI 9 HX 375 AMDRyzen AI 9 365 vs CPU AMDRyzen AI 7 350 Show 12 more

AppleM4 Max (16C40G) vs CPU AppleM5 Max (18C32G) AppleM4 Max (16C40G) vs CPU AppleM5 Max (18C40G) AppleM4 Max (16C40G) vs CPU AppleM3 Max (14C30G) Show 12 more