AMD Ryzen AI Max 385 vs Intel Core i3-12100 Full Specs

Summary

8 Cores 16 Threads 3.6GHz	4 Cores 8 Threads 3.3GHz
TDP 65W	TDP 65W
Bandwidth 256GB/s LPDDR5X	Bandwidth 76.8GB/s DDR5·DDR4
iGPU Radeon 8050S	iGPU UHD 730 1400MHz
Peak·FP32·FP16 22.94 TFLOPSFP16	Peak·FP32·FP16 1.07 TFLOPSFP16
Socket FP11	Socket LGA 1700

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Ryzen AI Max 385-

-

Core i3-121002,326

x1

Show Top Score

Core Config

8 Cores	4 Cores
16 Threads	8 Threads

Clocks

Base Clock 3.6GHz	Base Clock 3.3GHz
Boost Clock 5GHz	Boost Clock 4.3GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB	L1i 32KB
L1d 48KB	L1d 48KB
L2 1MB	L2 1.25MB
L3 32MB	L3 12MB

Memory

Type LPDDR5X	Type DDR5·DDR4
Max Memory 128GB	Max Memory 128GB
ECC No	ECC No
Channels 4	Channels 2
Bus Width 256-bit	Bus Width 128-bit
Speed 8000MT/s	Speed 4800MT/s
Bandwidth 256GB/s	Bandwidth 76.8GB/s
Bandwidth Calculator Channels Transfer Rate8000MT/s Calculated Bandwidth 256GB/s	Bandwidth Calculator Channels Transfer Rate4800MT/s Calculated Bandwidth 76.8GB/s

Power & Thermals

TDP 65W	TDP 65W
cTDP-down 45W	cTDP-down -
cTDP-up 120W	cTDP-up -
Peak Power -	Peak Power 89W
Max Operating Temp 100°C Max	Max Operating Temp 100°C Max
Included Cooler 0	Included Cooler 1

Chipset Bus

Bus Type PCIe	Bus Type DMI
Bus Config 4 lanes	Bus Config 8 lanes
Bus Speed 16GT/s	Bus Speed 16GT/s
Bus Bandwidth 8GB/s	Bus Bandwidth 16GB/s

Expansion

PCIe PCIe 4.0 x16 31.5GB/sBandwidth	PCIe PCIe 5.0 x16 63GB/sBandwidth
-	PCIe Secondary PCIe 4.0 x4 7.9GB/sBandwidth

iGPU

iGPU Radeon 8050S	iGPU UHD 730 1400MHz
Shaders 2048	Shaders 192
Boost Clock 2.8GHz	Boost Clock 1.4GHz
Peak·FP32·FP16 22.94 TFLOPSFP16	Peak·FP32·FP16 1.07 TFLOPSFP16

NPU

NPU Model XDNA 2	NPU Model GNA 3.0
NPU Cores 32	NPU Cores -
Performance 50 TOPSINT8	Performance -

Chip

Manufacturer AMD	Manufacturer Intel
ISA x86-64	ISA x86-64
Architecture Zen 5	Architecture Alder Lake
Family Ryzen AI 300	Family Core 12th Gen
Branding	Branding
Codename Strix Halo EldoraDie - Zen 5P-Core	Codename Alder Lake-S - Alder Lake-6PVariant Golden CoveP-Core
Market Segment Laptop	Market Segment Desktop
Release Date Jan 6, 2025	Release Date Jan 18, 2022

Fabrication

Foundry TSMC	Foundry Intel
Other Foundries TSMCSoC	Other Foundries -
Fabrication Node N4X N5SoC	Fabrication Node Intel 7 -
Die Size 71mm²	Die Size 158mm²
Transistor Count 8.3 Billion	Transistor Count 11.4 Billion
Transistor Density 118 MTr/mm²	Transistor Density 72 MTr/mm²

Images

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Used In

Desktops Framework Desktop(Early 2025)

Desktops Inspiron(ND3910, Early 2022)

Competitors

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IntelCore i3-12100 vs CPU IntelXeon 6315P IntelCore i3-12100 vs CPU AMDRyzen 3 5305G IntelCore i3-12100 vs CPU AMDRyzen 3 5305GE Show 12 more