AMD Ryzen AI Max PRO 380 vs Intel Core i3-L13G4 Full Specs

Summary

6 Cores 12 Threads 3.6GHz	5 Cores(1P+4E) 6 Threads(2P+4E) 800MHz
TDP 65W	TDP -
Bandwidth 256GB/s LPDDR5X	Bandwidth 34.1GB/s LPDDR4X
iGPU Radeon 8040S	iGPU UHD 48EU 500MHz Gen 11
Peak·FP32·FP16 11.47 TFLOPSFP16	Peak·FP32·FP16 768 GFLOPSFP16
Socket FP11	Socket CSP 1016

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Ryzen AI Max PRO 380-

-

Core i3-L13G4646

x1

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Core Config

6 Cores 6P -	5 Cores 1P 4E
12 Threads 12P -	6 Threads 2P 4E

Clocks

Base Clock 3.6GHz	Base Clock 800MHz
Boost Clock 4.9GHz	Boost Clock 2.8GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB P -	L1i 32KB P 32KB E
L1d 48KB P -	L1d 48KB P 32KB E
L2 1MB P -	L2 512KB P 1.5MB E shared
L3 16MB	L3 8MB

Memory

Type LPDDR5X	Type LPDDR4X
Max Memory 128GB	Max Memory 8GB
ECC No	ECC No
Channels 4	Channels 1
Bus Width 256-bit	Bus Width 64-bit
Speed 8000MT/s	Speed 4266MT/s
Bandwidth 256GB/s	Bandwidth 34.1GB/s
Bandwidth Calculator Channels Transfer Rate8000MT/s Calculated Bandwidth 256GB/s	Bandwidth Calculator Channels Transfer Rate4266MT/s Calculated Bandwidth 34.1GB/s

Power & Thermals

TDP 65W	TDP -
cTDP-down 45W	cTDP-down -
cTDP-up 120W	cTDP-up -
Max Operating Temp 100°C Max	Max Operating Temp 100°C Max
Included Cooler 0	Included Cooler 0

Chipset Bus

Bus Type PCIe	Bus Type OPI
Bus Config 4 lanes	Bus Config 4 lanes
Bus Speed 16GT/s	Bus Speed 4GT/s
Bus Bandwidth 8GB/s	Bus Bandwidth 2GB/s

Expansion

PCIe PCIe 4.0 x16 31.5GB/sBandwidth

PCIe PCIe 3.0 x6 5.9GB/sBandwidth

iGPU

iGPU Radeon 8040S	iGPU UHD 48EU 500MHz Gen 11
Shaders 1024	Shaders 384
Boost Clock 2.8GHz	Boost Clock 500MHz
Peak·FP32·FP16 11.47 TFLOPSFP16	Peak·FP32·FP16 768 GFLOPSFP16

NPU

NPU Model XDNA 2	NPU Model -
NPU Cores 32	NPU Cores -
Performance 50 TOPSINT8	Performance -

Chip

Manufacturer AMD	Manufacturer Intel
ISA x86-64	ISA x86-64
Architecture Zen 5	Architecture Lakefield
Family Ryzen AI 300	Family Core 11th Gen
Branding	Branding
Codename Strix Halo EldoraDie Zen 5P-Core -	Codename Lakefield - Sunny CoveP-Core TremontE-Core
Market Segment Laptop	Market Segment Laptop
Release Date Jan 6, 2025	Release Date May 28, 2020

Fabrication

Foundry TSMC	Foundry Intel
Other Foundries - TSMCSoC	Other Foundries IntelIO -
Fabrication Node N4X - N5SoC	Fabrication Node 10nm+ 22nmIO -
Die Size 71mm² -	Die Size 82mm² 92mm²IO
Transistor Count 8.3 Billion -	Transistor Count 4 Billion 650 MillionIO
Transistor Density 118 MTr/mm² -	Transistor Density 49 MTr/mm² 7 MTr/mm²IO

Images

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Used In

Laptops -

Laptops Galaxy Book S(Mid 2020)

Competitors

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