CPUs

Apple A7 vs Intel Core m3-7Y30 Full Specs

2 Cores
2 Threads
1.3GHz
2 Cores
4 Threads
1GHz
TDP
5W
TDP
5W
Bandwidth
12.8GB/s
LPDDR3
Bandwidth
29.9GB/s
·
iGPU
iGPU
··
192 GFLOPSFP16
··
345.6 GFLOPSFP16
Socket
-
Socket

2 Cores
2 Cores
2 Threads
4 Threads

Base Clock
1.3GHz
Base Clock
1GHz
Boost Clock
-
Boost Clock
2.6GHz
Overclocking
Locked
Overclocking
Locked

L1i
64KB
L1i
32KB
L1d
64KB
L1d
32KB
L2
1MB shared
L2
256KB
L3
4MB
L3
4MB

Type
LPDDR3
Type
·
Max Memory
1GB
Max Memory
16GB
ECC
No
ECC
No
Channels
1
Channels
2
Bus Width
64-bit
Bus Width
128-bit
Speed
1600MT/s
Speed
1866MT/s
Bandwidth
12.8GB/s
Bandwidth
29.9GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
12.8GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
29.9GB/s

TDP
5W
TDP
5W
cTDP-down
-
cTDP-down
4W
cTDP-up
-
cTDP-up
7W
Max Operating Temp
-
Max Operating Temp
100°C Max

Bus Type
-
Bus Type
OPI
Bus Config
-
Bus Config
4 lanes
Bus Speed
-
Bus Speed
4GT/s
Bus Bandwidth
-
Bus Bandwidth
2GB/s

-
PCIe
PCIe 3.0 x10
9.8GB/sBandwidth

iGPU
iGPU
Shaders
128
Shaders
192
Boost Clock
375MHz
Boost Clock
900MHz
··
192 GFLOPSFP16
··
345.6 GFLOPSFP16

Controller Model
-
Controller Model
200 Series Y+
Codename
-
Codename
Kaby Lake
PCIe
-
PCIe
-

Manufacturer
Manufacturer
ISA
AArch64
ISA
x86-64
Architecture
Architecture
Family
Family
Branding
A7  branding
Branding
Core m3 2015 branding
Codename
Alcatraz
A7Variant
CycloneP-Core
Codename
Kaby Lake-H
Kaby Lake-2C-GT2Variant
-
Market Segment
Smartphone
Market Segment
Laptop
Release Date
Sep 20, 2013
Release Date
Jan 3, 2017

Foundry
Samsung
Foundry
Intel
Other Foundries
-
Other Foundries
IntelPCH
Fabrication Node
28nm
-
Fabrication Node
14nm+
22nmPCH
Die Size
102mm²
-
Die Size
103mm²
50mm²PCH
Transistor Count
1 Billion
Transistor Count
1.8 Billion
Transistor Density
10 MTr/mm²
Transistor Density
17 MTr/mm²