Apple M2 Pro (12C19G) vs Qualcomm Snapdragon X2 Elite (X2E-80-100) Full Specs

Summary

12 Cores(8P+4E) 12 Threads(8P+4E) 3.5GHz	12 Cores(6P+6E) 12 Threads(6P+6E) 4GHz
TDP 60W	TDP 80W
Bandwidth 204.8GB/s LPDDR5	Bandwidth 152.4GB/s LPDDR5X
iGPU 19-Core M2 Pro	iGPU Adreno X2-85 5.2T
Peak·FP32·FP16 6.8 TFLOPSFP16	Peak·FP32·FP16 10.44 TFLOPSFP16

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

M2 Pro (12C19G)2,680

x1

Snapdragon X2 Elite (X2E-80-100)-

-

Show Top Score

Core Config

12 Cores 8P 4E	12 Cores 6P 6E
12 Threads 8P 4E	12 Threads 6P 6E

Clocks

Base Clock 3.5GHz	Base Clock 4GHz
Boost Clock -	Boost Clock 4.7GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 192KB P 128KB E	L1i 192KB P 128KB E
L1d 128KB P 64KB E	L1d 96KB P 64KB E
L2 24MB P shared 4MB E shared	L2 18MB P shared 12MB E shared
SLC Cache 24MB	SLC Cache -

Memory

Type LPDDR5	Type LPDDR5X
Max Memory 32GB	Max Memory 128GB
ECC No	ECC No
Channels 4	Channels 8
Bus Width 256-bit	Bus Width 128-bit
Speed 6400MT/s	Speed 9523MT/s
Bandwidth 204.8GB/s	Bandwidth 152.4GB/s
Bandwidth Calculator Channels Transfer Rate6400MT/s Calculated Bandwidth 204.8GB/s	Bandwidth Calculator Channels Transfer Rate9523MT/s Calculated Bandwidth 152.4GB/s

Power & Thermals

TDP 60W	TDP 80W
Max Operating Temp 100°C Max	Max Operating Temp -

Expansion

PCIe PCIe 4.0 x16 31.5GB/sBandwidth	PCIe PCIe 5.0 x8 31.5GB/sBandwidth
-	PCIe Secondary PCIe 4.0 x4 7.9GB/sBandwidth

iGPU

iGPU 19-Core M2 Pro	iGPU Adreno X2-85 5.2T
Shaders 2432	Shaders 1536
Boost Clock 1.4GHz	Boost Clock 1.7GHz
Peak·FP32·FP16 6.8 TFLOPSFP16	Peak·FP32·FP16 10.44 TFLOPSFP16

NPU

NPU Model H14 Selene	NPU Model Hexagon
NPU Cores 16	NPU Cores -
NPU Clock 2.1GHz	NPU Clock -
Performance 15.8 TOPSFP16	Performance 80 TOPSINT8

Chip

Manufacturer Apple	Manufacturer Qualcomm
ISA AArch64	ISA AArch64
Architecture Apple Silicon 11ARMv8.5-A	Architecture Oryon 3ARMv8.7-A
Family M Series	Family X Series
Branding	Branding
Codename Rhodes-Chop M2 ProVariant AvalancheP-Core BlizzardE-Core	Codename Glymur - Pegasus-PP-Core Pegasus-EE-Core
Market Segment Laptop	Market Segment Laptop
Release Date Jan 17, 2023	Release Date Sep 24, 2025

Fabrication

Foundry TSMC	Foundry TSMC
Fabrication Node N5P	Fabrication Node N3E
Die Size 295mm²	Die Size 288mm²
Transistor Count 40 Billion	Transistor Count -
Transistor Density 136 MTr/mm²	Transistor Density -

Images

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Used In

Laptops MacBook Pro 14(M2 Pro, Early 2023)MacBook Pro 16(M2 Pro, Early 2023)	Laptops -
Desktops Mac mini(M2 Pro, Early 2023)	Desktops -

Competitors

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QualcommSnapdragon X2 Elite (X2E-80-100) vs CPU QualcommSnapdragon X2 Elite (X2E-88-100) QualcommSnapdragon X2 Elite (X2E-80-100) vs CPU QualcommSnapdragon X2 Elite Extreme (X2E-96-100) QualcommSnapdragon X2 Elite (X2E-80-100) vs CPU AMDRyzen AI Max 390 Show 12 more