CPUs

Apple M3 (8C9G-FL) vs Intel Core i3-1115G4 Full Specs

8 Cores(4P+4E)
8 Threads(4P+4E)
4.05GHz
2 Cores
4 Threads
2.2GHz
TDP
15W
TDP
15W
Bandwidth
102.4GB/s
LPDDR5
Bandwidth
59.7GB/s
·
iGPU
iGPU
··
3.08 TFLOPSFP16
··
1.92 TFLOPSFP16
Socket
-
Socket

M3 (8C9G-FL)M3 (8C9G-FL)3,130
x1.93
Core i3-1115G4Core i3-1115G41,625
x1

8 Cores
4P
4E
2 Cores
2P
-
8 Threads
4P
4E
4 Threads
4P
-

Base Clock
4.05GHz
Base Clock
2.2GHz
Boost Clock
-
Boost Clock
4.1GHz
Overclocking
Locked
Overclocking
Locked

L1i
192KB P
128KB E
L1i
32KB P
-
L1d
128KB P
64KB E
L1d
48KB P
-
L2
16MB P shared
4MB E shared
L2
1.25MB P
-
-
L3
-
L3
6MB
SLC Cache
8MB
SLC Cache
-

Type
LPDDR5
Type
·
Max Memory
24GB
Max Memory
32GB
ECC
No
ECC
No
Channels
2
Channels
2
Bus Width
128-bit
Bus Width
128-bit
Speed
6400MT/s
Speed
3733MT/s
Bandwidth
102.4GB/s
Bandwidth
59.7GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
102.4GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
59.7GB/s

TDP
15W
TDP
15W
cTDP-down
-
cTDP-down
12W
cTDP-up
-
cTDP-up
28W
Max Operating Temp
100°C Max
Max Operating Temp
100°C Max

Bus Type
-
Bus Type
OPI
Bus Config
-
Bus Config
8 lanes
Bus Speed
-
Bus Speed
4GT/s
Bus Bandwidth
-
Bus Bandwidth
4GB/s

PCIe
PCIe 4.0 x6
11.8GB/sBandwidth
PCIe
PCIe 4.0 x4
7.9GB/sBandwidth

iGPU
iGPU
Shaders
1152
Shaders
384
Boost Clock
1.34GHz
Boost Clock
1.25GHz
··
3.08 TFLOPSFP16
··
1.92 TFLOPSFP16

NPU Model
H15 Themis
NPU Model
GNA 2.0
NPU Cores
16
NPU Cores
-
NPU Clock
2.36GHz
NPU Clock
-
Performance
18 TOPSFP16
Performance
-

Controller Model
-
Controller Model
500 Series UP3+
Codename
-
Codename
Tiger Lake
PCIe
-
PCIe
-

Manufacturer
Manufacturer
ISA
AArch64
ISA
x86-64
Architecture
Architecture
Family
Family
Branding
M3  branding
Branding
Core i3 2020 branding
Codename
Ibiza
M3Variant
EverestP-Core
Sawtooth E-Core
Codename
Tiger Lake-UP3
Tiger Lake-4C-GT2Variant
Willow CoveP-Core
-
Market Segment
Tablet
Market Segment
Laptop
Release Date
Mar 4, 2025
Release Date
Sep 2, 2020

Foundry
TSMC
Foundry
Intel
Other Foundries
-
Other Foundries
IntelPCH
Fabrication Node
N3B
-
Fabrication Node
10nm SuperFin
14nmPCH
Die Size
153mm²
-
Die Size
123mm²
46mm²PCH
Transistor Count
25 Billion
Transistor Count
8 Billion
Transistor Density
164 MTr/mm²
Transistor Density
65 MTr/mm²

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