CPUs

Apple M4 (9C10G-FL) vs Qualcomm Snapdragon 8 Gen 3 Full Specs

9 Cores(3P+6E)
9 Threads(3P+6E)
4.1GHz
8 Cores(1P+5M+2E)
8 Threads(1P+5M+2E)
3.3GHz
TDP
15W
TDP
5W
Bandwidth
120GB/s
LPDDR5X
Bandwidth
76.8GB/s
LPDDR5X
iGPU
iGPU
··
4.04 TFLOPSFP16
··
5.53 TFLOPSFP16

9 Cores
3P
-
6E
8 Cores
1P
5M
2E
9 Threads
3P
-
6E
8 Threads
1P
5M
2E

Base Clock
4.1GHz
Base Clock
3.3GHz
Overclocking
Locked
Overclocking
Locked

L1i
192KB P
-
128KB E
L1i
64KB P
64KB M
32KB E
L1d
128KB P
-
64KB E
L1d
64KB P
64KB M
32KB E
L2
16MB P shared
4MB E shared
L2
1MB P
512KB M
128KB E
-
-
L3
-
L3
12MB
SLC Cache
8MB
SLC Cache
4MB

Type
LPDDR5X
Type
LPDDR5X
Max Memory
24GB
Max Memory
24GB
ECC
No
ECC
No
Channels
2
Channels
4
Bus Width
128-bit
Bus Width
64-bit
Speed
7500MT/s
Speed
9600MT/s
Bandwidth
120GB/s
Bandwidth
76.8GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
120GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
76.8GB/s

TDP
15W
TDP
5W
Max Operating Temp
100°C Max
Max Operating Temp
-

PCIe
PCIe 4.0 x5
9.8GB/sBandwidth
-

iGPU
iGPU
Shaders
1280
Shaders
1536
Boost Clock
1.58GHz
Boost Clock
900MHz
··
4.04 TFLOPSFP16
··
5.53 TFLOPSFP16

NPU Model
H16 Leto
NPU Model
Hexagon
NPU Cores
16
NPU Cores
-
NPU Clock
2.36GHz
NPU Clock
-
Performance
38 TOPSINT8
Performance
45 TOPSINT8

Modem Model
-
Modem Model
X75
Cellular
-
Cellular
5G mmWave
Peak Down
-
Peak Down
Up to 10.0Gbps
Peak Up
-
Peak Up
Up to 3.5Gbps

Manufacturer
Manufacturer
ISA
AArch64
ISA
AArch64
Architecture
Architecture
KryoARMv9.0-A
Family
Family
Branding
M4 FL  branding
Branding
Snapdragon 8 Gen 3  branding
Codename
Donan
M4Variant
AS14PP-Core
-
AS14EE-Core
Codename
-
Snapdragon 8 Gen 3Variant
Cortex-X4P-Core
Cortex-A720M-Core
Cortex-A520E-Core
Market Segment
Tablet
Market Segment
Smartphone
Release Date
May 7, 2024
Release Date
Oct 24, 2023

Foundry
TSMC
Foundry
TSMC
Fabrication Node
N3E
Fabrication Node
N4P
Die Size
169mm²
Die Size
137mm²
Transistor Count
28 Billion
Transistor Count
-
Transistor Density
165 MTr/mm²
Transistor Density
-