Intel Core i3-1115G4 vs Qualcomm Snapdragon 662 Full Specs

Summary

2 Cores 4 Threads 2.2GHz	8 Cores(4P+4E) 8 Threads(4P+4E) 2GHz
TDP 15W	TDP 5W
Bandwidth 59.7GB/s LPDDR4X·DDR4	Bandwidth 14.9GB/s LPDDR4X
iGPU UHD 48EU 1250MHz Gen 12	iGPU Adreno 610
Peak·FP32·FP16 1.92 TFLOPSFP16	Peak·FP32·FP16 486.4 GFLOPSFP16
Socket BGA 1449	Socket -

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 TDP

Core i3-1115G41,625

x4.91

Snapdragon 662331

x1

Show Top Score

Core Config

2 Cores 2P -	8 Cores 4P 4E
4 Threads 4P -	8 Threads 4P 4E

Clocks

Base Clock 2.2GHz	Base Clock 2GHz
Boost Clock 4.1GHz	Boost Clock -
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB P -	L1i 32KB P 16KB E
L1d 48KB P -	L1d 32KB P 16KB E
L2 1.25MB P - -	L2 2MB P shared 1MB E shared
L3 6MB	L3 -

Memory

Type LPDDR4X·DDR4	Type LPDDR4X
Max Memory 32GB	Max Memory 8GB
ECC No	ECC No
Channels 2	Channels 2
Bus Width 128-bit	Bus Width 32-bit
Speed 3733MT/s	Speed 3733MT/s
Bandwidth 59.7GB/s	Bandwidth 14.9GB/s
Bandwidth Calculator Channels Transfer Rate3733MT/s Calculated Bandwidth 59.7GB/s	Bandwidth Calculator Channels Transfer Rate3733MT/s Calculated Bandwidth 14.9GB/s

Power & Thermals

TDP 15W	TDP 5W
cTDP-down 12W	cTDP-down -
cTDP-up 28W	cTDP-up -
Max Operating Temp 100°C Max	Max Operating Temp -

Chipset Bus

Bus Type OPI	Bus Type -
Bus Config 8 lanes	Bus Config -
Bus Speed 4GT/s	Bus Speed -
Bus Bandwidth 4GB/s	Bus Bandwidth -

Expansion

PCIe PCIe 4.0 x4 7.9GB/sBandwidth

-

iGPU

iGPU UHD 48EU 1250MHz Gen 12	iGPU Adreno 610
Shaders 384	Shaders 128
Boost Clock 1.25GHz	Boost Clock 950MHz
Peak·FP32·FP16 1.92 TFLOPSFP16	Peak·FP32·FP16 486.4 GFLOPSFP16

NPU

NPU Model GNA 2.0

NPU Model Hexagon 683

Cellular

Modem Model -	Modem Model X11
Peak Down -	Peak Down Up to 390Mbps
Peak Up -	Peak Up Up to 150Mbps

Controller

Controller Model 500 Series UP3+	Controller Model -
Codename Tiger Lake	Codename -
PCIe -	PCIe -

Chip

Manufacturer Intel	Manufacturer Qualcomm
ISA x86-64	ISA AArch64
Architecture Tiger Lake	Architecture Kryo 260ARMv8.0-A
Family Core 11th Gen	Family 6 Series
Branding	Branding
Codename Tiger Lake-UP3 Tiger Lake-4C-GT2Variant Willow CoveP-Core -	Codename - - Cortex-A73P-Core Cortex-A53E-Core
Market Segment Laptop	Market Segment Smartphone
Release Date Sep 2, 2020	Release Date Jan 20, 2020

Fabrication

Foundry Intel	Foundry Samsung
Other Foundries IntelPCH	Other Foundries -
Fabrication Node 10nm SuperFin 14nmPCH	Fabrication Node 14LPP -
Die Size 123mm² 46mm²PCH	Die Size -
Transistor Count 8 Billion	Transistor Count -
Transistor Density 65 MTr/mm²	Transistor Density -

Images

No images available

No images available

Used In

Laptops XPS 13(9310, Late 2020)XPS 13 2-in-1(29310, Late 2020)Galaxy Book Pro 360 13(Early 2021) Show 1 more	Laptops -
Tablets Surface Pro 7+(Intel 11th Gen, Early 2021)Surface Pro 8(Intel 11th Gen, Late 2021)	Tablets Galaxy Tab A7(SD 662, Late 2020)

Competitors

IntelCore i3-1115G4 vs CPU IntelCore Ultra 5 332 IntelCore i3-1115G4 vs CPU IntelCore Ultra 5 322 IntelCore i3-1115G4 vs CPU IntelCore Ultra 5 325 Show 12 more

QualcommSnapdragon 662 vs CPU QualcommSnapdragon 6 Gen 4 QualcommSnapdragon 662 vs CPU GoogleTensor G5 QualcommSnapdragon 662 vs CPU AppleA18 Pro (Neo) Show 12 more