CPUs

Intel Core i3-7100H vs AMD Ryzen 5 7400F Full Specs

2 Cores
4 Threads
3GHz
6 Cores
12 Threads
3.7GHz
TDP
35W
TDP
65W
Bandwidth
38.4GB/s
··
Bandwidth
83.2GB/s
DDR5
iGPU
iGPU
0
··
364.8 GFLOPSFP16
··
-
Socket
Socket

Core i3-7100HCore i3-7100H895
x1
Ryzen 5 7400FRyzen 5 7400F2,743
x3.06

2 Cores
6 Cores
4 Threads
12 Threads

Base Clock
3GHz
Base Clock
3.7GHz
Boost Clock
-
Boost Clock
4.7GHz
Overclocking
Locked
Overclocking
Unlocked

L1i
32KB
L1i
32KB
L1d
32KB
L1d
32KB
L2
256KB
L2
1MB
L3
3MB
L3
32MB

Type
··
Type
DDR5
Max Memory
64GB
Max Memory
192GB
ECC
No
ECC
No
Channels
2
Channels
2
Bus Width
128-bit
Bus Width
128-bit
Speed
2400MT/s
Speed
5200MT/s
Bandwidth
38.4GB/s
Bandwidth
83.2GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
38.4GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
83.2GB/s

TDP
35W
TDP
65W
Max Operating Temp
100°C Max
Max Operating Temp
95°C Max
Included Cooler
-
Included Cooler
1

Bus Type
DMI
Bus Type
PCIe
Bus Config
4 lanes
Bus Config
4 lanes
Bus Speed
8GT/s
Bus Speed
32GT/s
Bus Bandwidth
4GB/s
Bus Bandwidth
16GB/s

PCIe
PCIe 3.0 x16
15.8GB/sBandwidth
PCIe
PCIe 5.0 x24
94.5GB/sBandwidth

iGPU
iGPU
0
Shaders
192
Shaders
-
Boost Clock
950MHz
Boost Clock
-
··
364.8 GFLOPSFP16
··
-

Manufacturer
Manufacturer
ISA
x86-64
ISA
x86-64
Architecture
Architecture
Family
Family
Branding
Core i3 2016 branding
Branding
Ryzen 5 2017 branding
Codename
Kaby Lake-H
-
Kaby Lake-2C-GT2Variant
Codename
Raphael
DurangoDie
Raphael 1CCDVariant
Market Segment
Laptop
Market Segment
Desktop
Release Date
Jan 3, 2017
Release Date
Jan 9, 2025

Foundry
Intel
Foundry
TSMC
Other Foundries
-
Other Foundries
TSMCIO
Fabrication Node
14nm+
-
Fabrication Node
N5
N6IO
Die Size
103mm²
-
Die Size
71mm²
122mm²IO
Transistor Count
1.8 Billion
-
Transistor Count
6.6 Billion
3.4 BillionIO
Transistor Density
17 MTr/mm²
-
Transistor Density
93 MTr/mm²
28 MTr/mm²IO

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