Intel Core i3-L13G4 vs AMD Ryzen AI Max PRO 380 Full Specs

Summary

5 Cores(1P+4E) 6 Threads(2P+4E) 800MHz	6 Cores 12 Threads 3.6GHz
TDP -	TDP 65W
Bandwidth 34.1GB/s LPDDR4X	Bandwidth 256GB/s LPDDR5X
iGPU UHD 48EU 500MHz Gen 11	iGPU Radeon 8040S
Peak·FP32·FP16 768 GFLOPSFP16	Peak·FP32·FP16 11.47 TFLOPSFP16
Socket CSP 1016	Socket FP11

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Core i3-L13G4646

x1

Ryzen AI Max PRO 380-

-

Show Top Score

Core Config

5 Cores 1P 4E	6 Cores 6P -
6 Threads 2P 4E	12 Threads 12P -

Clocks

Base Clock 800MHz	Base Clock 3.6GHz
Boost Clock 2.8GHz	Boost Clock 4.9GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB P 32KB E	L1i 32KB P -
L1d 48KB P 32KB E	L1d 48KB P -
L2 512KB P 1.5MB E shared	L2 1MB P -
L3 8MB	L3 16MB

Memory

Type LPDDR4X	Type LPDDR5X
Max Memory 8GB	Max Memory 128GB
ECC No	ECC No
Channels 1	Channels 4
Bus Width 64-bit	Bus Width 256-bit
Speed 4266MT/s	Speed 8000MT/s
Bandwidth 34.1GB/s	Bandwidth 256GB/s
Bandwidth Calculator Channels Transfer Rate4266MT/s Calculated Bandwidth 34.1GB/s	Bandwidth Calculator Channels Transfer Rate8000MT/s Calculated Bandwidth 256GB/s

Power & Thermals

TDP -	TDP 65W
cTDP-down -	cTDP-down 45W
cTDP-up -	cTDP-up 120W
Max Operating Temp 100°C Max	Max Operating Temp 100°C Max
Included Cooler 0	Included Cooler 0

Chipset Bus

Bus Type OPI	Bus Type PCIe
Bus Config 4 lanes	Bus Config 4 lanes
Bus Speed 4GT/s	Bus Speed 16GT/s
Bus Bandwidth 2GB/s	Bus Bandwidth 8GB/s

Expansion

PCIe PCIe 3.0 x6 5.9GB/sBandwidth

PCIe PCIe 4.0 x16 31.5GB/sBandwidth

iGPU

iGPU UHD 48EU 500MHz Gen 11	iGPU Radeon 8040S
Shaders 384	Shaders 1024
Boost Clock 500MHz	Boost Clock 2.8GHz
Peak·FP32·FP16 768 GFLOPSFP16	Peak·FP32·FP16 11.47 TFLOPSFP16

NPU

NPU Model -	NPU Model XDNA 2
NPU Cores -	NPU Cores 32
Performance -	Performance 50 TOPSINT8

Chip

Manufacturer Intel	Manufacturer AMD
ISA x86-64	ISA x86-64
Architecture Lakefield	Architecture Zen 5
Family Core 11th Gen	Family Ryzen AI 300
Branding	Branding
Codename Lakefield - Sunny CoveP-Core TremontE-Core	Codename Strix Halo EldoraDie Zen 5P-Core -
Market Segment Laptop	Market Segment Laptop
Release Date May 28, 2020	Release Date Jan 6, 2025

Fabrication

Foundry Intel	Foundry TSMC
Other Foundries IntelIO -	Other Foundries - TSMCSoC
Fabrication Node 10nm+ 22nmIO -	Fabrication Node N4X - N5SoC
Die Size 82mm² 92mm²IO	Die Size 71mm² -
Transistor Count 4 Billion 650 MillionIO	Transistor Count 8.3 Billion -
Transistor Density 49 MTr/mm² 7 MTr/mm²IO	Transistor Density 118 MTr/mm² -

Images

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Used In

Laptops Galaxy Book S(Mid 2020)

Laptops -

Competitors

IntelCore i3-L13G4 vs CPU AMDRyzen AI 5 PRO 340 IntelCore i3-L13G4 vs CPU AMDRyzen AI 5 340 IntelCore i3-L13G4 vs CPU AMDRyzen 3 PRO 210 Show 4 more

AMDRyzen AI Max PRO 380 vs CPU AMDRyzen AI Max 385 AMDRyzen AI Max PRO 380 vs CPU AMDRyzen AI Max PRO 385 AMDRyzen AI Max PRO 380 vs CPU AMDRyzen 5 240 Show 12 more