Intel Core i3-L13G4 vs Intel Core i9-11950H Full Specs

Summary

5 Cores(1P+4E) 6 Threads(2P+4E) 800MHz	8 Cores 16 Threads 2.6GHz
TDP -	TDP 45W
Bandwidth 34.1GB/s LPDDR4X	Bandwidth 51.2GB/s DDR4
iGPU UHD 48EU 500MHz Gen 11	iGPU UHD 32EU 1450MHz Gen 12
Peak·FP32·FP16 768 GFLOPSFP16	Peak·FP32·FP16 1.49 TFLOPSFP16
Socket CSP 1016	Socket BGA 1787

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 TDP

Core i3-L13G4646

x1

Core i9-11950H2,042

x3.16

Show Top Score

Core Config

5 Cores 1P 4E	8 Cores 8P -
6 Threads 2P 4E	16 Threads 16P -

Clocks

Base Clock 800MHz	Base Clock 2.6GHz
Boost Clock 2.8GHz	Boost Clock 5GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB P 32KB E	L1i 32KB P -
L1d 48KB P 32KB E	L1d 48KB P -
L2 512KB P 1.5MB E shared	L2 1.25MB P -
L3 8MB	L3 24MB

Memory

Type LPDDR4X	Type DDR4
Max Memory 8GB	Max Memory 128GB
ECC No	ECC No
Channels 1	Channels 2
Bus Width 64-bit	Bus Width 128-bit
Speed 4266MT/s	Speed 3200MT/s
Bandwidth 34.1GB/s	Bandwidth 51.2GB/s
Bandwidth Calculator Channels Transfer Rate4266MT/s Calculated Bandwidth 34.1GB/s	Bandwidth Calculator Channels Transfer Rate3200MT/s Calculated Bandwidth 51.2GB/s

Power & Thermals

TDP -	TDP 45W
cTDP-down -	cTDP-down 35W
Max Operating Temp 100°C Max	Max Operating Temp 100°C Max
Included Cooler 0	Included Cooler -

Chipset Bus

Bus Type OPI	Bus Type DMI
Bus Config 4 lanes	Bus Config 8 lanes
Bus Speed 4GT/s	Bus Speed 8GT/s
Bus Bandwidth 2GB/s	Bus Bandwidth 8GB/s

Expansion

PCIe PCIe 3.0 x6 5.9GB/sBandwidth

PCIe PCIe 4.0 x20 39.4GB/sBandwidth

iGPU

iGPU UHD 48EU 500MHz Gen 11	iGPU UHD 32EU 1450MHz Gen 12
Shaders 384	Shaders 256
Boost Clock 500MHz	Boost Clock 1.45GHz
Peak·FP32·FP16 768 GFLOPSFP16	Peak·FP32·FP16 1.49 TFLOPSFP16

NPU

NPU Model -

NPU Model GNA 2.0

Chip

Manufacturer Intel	Manufacturer Intel
ISA x86-64	ISA x86-64
Architecture Lakefield	Architecture Tiger Lake
Family Core 11th Gen	Family Core 11th Gen
Branding	Branding
Codename Lakefield - Sunny CoveP-Core TremontE-Core	Codename Tiger Lake-B Tiger Lake-8CVariant Willow CoveP-Core -
Market Segment Laptop	Market Segment Laptop
Release Date May 28, 2020	Release Date May 11, 2021

Fabrication

Foundry Intel	Foundry Intel
Other Foundries IntelIO	Other Foundries -
Fabrication Node 10nm+ 22nmIO	Fabrication Node 10nm SuperFin -
Die Size 82mm² 92mm²IO	Die Size 190mm² -
Transistor Count 4 Billion 650 MillionIO	Transistor Count 12.3 Billion -
Transistor Density 49 MTr/mm² 7 MTr/mm²IO	Transistor Density 65 MTr/mm² -

Images

No images available

No images available

Used In

Laptops Galaxy Book S(Mid 2020)

Laptops -

Competitors

IntelCore i3-L13G4 vs CPU AMDRyzen AI 5 PRO 340 IntelCore i3-L13G4 vs CPU AMDRyzen 3 210 IntelCore i3-L13G4 vs CPU AMDRyzen AI Max PRO 380 Show 6 more

IntelCore i9-11950H vs CPU AMDRyzen AI 7 PRO 350 IntelCore i9-11950H vs CPU AMDRyzen AI 7 350 IntelCore i9-11950H vs CPU AMDRyzen AI Max 385 Show 12 more