Intel Core i5-4570S vs AMD Ryzen 3 PRO 8300GE Full Specs

Summary

4 Cores 4 Threads 2.9GHz	4 Cores(1P+3E) 8 Threads(2P+6E) 3.5GHz
TDP 65W	TDP 35W
Bandwidth 25.6GB/s DDR3·DDR3L	Bandwidth 83.2GB/s DDR5
iGPU HD 4600 1150MHz	iGPU Radeon 740M 2600MHz
Peak·FP32·FP16 368 GFLOPSFP32	Peak·FP32·FP16 2.66 TFLOPSFP16
Socket LGA 1150	Socket AM5

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi E-Core Boost Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 TDP

Core i5-4570S1,131

x1

Ryzen 3 PRO 8300GE2,250

x1.99

Show Top Score

Core Config

4 Cores 4P -	4 Cores 1P 3E
4 Threads 4P -	8 Threads 2P 6E

Clocks

Base Clock 2.9GHz	Base Clock 3.5GHz
Boost Clock 3.6GHz	Boost Clock 4.9GHz
Overclocking Locked	Overclocking Unlocked

Cache

L1i 32KB P	L1i 32KB P
L1d 32KB P	L1d 32KB P
L2 256KB P	L2 1MB P
L3 6MB	L3 8MB

Memory

Type DDR3·DDR3L	Type DDR5
Max Memory 32GB	Max Memory 256GB
ECC No	ECC No
Channels 2	Channels 2
Bus Width 128-bit	Bus Width 128-bit
Speed 1600MT/s	Speed 5200MT/s
Bandwidth 25.6GB/s	Bandwidth 83.2GB/s
Bandwidth Calculator Channels Transfer Rate1600MT/s Calculated Bandwidth 25.6GB/s	Bandwidth Calculator Channels Transfer Rate5200MT/s Calculated Bandwidth 83.2GB/s

Power & Thermals

TDP 65W	TDP 35W
Max Operating Temp -	Max Operating Temp 95°C Max
T-Case 71.35°C Max	T-Case -

Chipset Bus

Bus Type DMI	Bus Type PCIe
Bus Config 4 lanes	Bus Config 4 lanes
Bus Speed 5GT/s	Bus Speed 16GT/s
Bus Bandwidth 2.5GB/s	Bus Bandwidth 8GB/s

Expansion

PCIe PCIe 3.0 x16 15.8GB/sBandwidth

PCIe PCIe 4.0 x10 19.7GB/sBandwidth

iGPU

iGPU HD 4600 1150MHz	iGPU Radeon 740M 2600MHz
Shaders 160	Shaders 256
Boost Clock 1.15GHz	Boost Clock 2.6GHz
Peak·FP32·FP16 368 GFLOPSFP32	Peak·FP32·FP16 2.66 TFLOPSFP16

Chip

Manufacturer Intel	Manufacturer AMD
ISA x86-64	ISA x86-64
Architecture Haswell	Architecture Zen 4
Family Core 4th Gen	Family Ryzen 8000
Branding	Branding
Codename Devil's Canyon Haswell-4C-GT2Variant - -	Codename Phoenix 2 - Zen 4P-Core Zen 4cE-Core
Market Segment Desktop	Market Segment Desktop
Release Date Jun 1, 2013	Release Date Apr 16, 2024

Fabrication

Foundry Intel	Foundry TSMC
Fabrication Node 22nm	Fabrication Node N4
Die Size 177mm²	Die Size 137mm²
Transistor Count 1.4 Billion	Transistor Count 20.9 Billion
Transistor Density 8 MTr/mm²	Transistor Density 153 MTr/mm²

Images

No images available

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Used In

All-in-Ones iMac 21.5(Late 2013)

All-in-Ones -

Competitors

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AMDRyzen 3 PRO 8300GE vs CPU AMDRyzen 3 PRO 8300G AMDRyzen 3 PRO 8300GE vs CPU AMDRyzen 5 PRO 8500GE AMDRyzen 3 PRO 8300GE vs CPU AMDRyzen 5 PRO 8600GE Show 12 more