CPUs

NVIDIA Grace Blackwell GB10 vs Apple M2 Ultra (24C60G) Full Specs

20 Cores(10P+10E)
20 Threads(10P+10E)
3GHz
24 Cores(16P+8E)
24 Threads(16P+8E)
3.69GHz
TDP
150W
TDP
300W
Bandwidth
273.1GB/s
LPDDR5X
Bandwidth
819.2GB/s
LPDDR5
iGPU
iGPU
··
992.9 TFLOPSFP16
··
21.47 TFLOPSFP16

Grace Blackwell GB10Grace Blackwell GB10-
-
M2 Ultra (24C60G)M2 Ultra (24C60G)2,700
x1

20 Cores
10P
10E
24 Cores
16P
8E
20 Threads
10P
10E
24 Threads
16P
8E

Base Clock
3GHz
Base Clock
3.69GHz
Overclocking
Locked
Overclocking
Locked

L1i
64KB P
-
L1i
192KB P
128KB E
L1d
64KB P
-
L1d
128KB P
64KB E
L2
1MB P
-
-
L2
48MB P shared
4MB E shared
SLC Cache
-
SLC Cache
96MB

Type
LPDDR5X
Type
LPDDR5
Max Memory
128GB
Max Memory
192GB
ECC
No
ECC
No
Channels
4
Channels
8
Bus Width
256-bit
Bus Width
1024-bit
Speed
8533MT/s
Speed
6400MT/s
Bandwidth
273.1GB/s
Bandwidth
819.2GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
273.1GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
819.2GB/s

TDP
150W
TDP
300W
Max Operating Temp
-
Max Operating Temp
100°C Max

-
PCIe
PCIe 4.0 x32
63GB/sBandwidth

iGPU
iGPU
Shaders
6144
Shaders
7680
Boost Clock
2.52GHz
Boost Clock
1.4GHz
··
992.9 TFLOPSFP16
··
21.47 TFLOPSFP16

NPU Model
-
NPU Model
H14 Selene
NPU Cores
-
NPU Cores
32
NPU Clock
-
NPU Clock
2.1GHz
Performance
-
Performance
31.6 TOPSFP16

Manufacturer
Manufacturer
ISA
AArch64
ISA
AArch64
Architecture
Architecture
Family
-
Family
Branding
Grace Blackwell GB10 branding
Branding
M2 Ultra  branding
Codename
Grace Blackwell
GB10Die
Grace Blackwell GB10Variant
Cortex-X925P-Core
Cortex-A725E-Core
Codename
Rhodes-2C
-
M2 UltraVariant
AvalancheP-Core
BlizzardE-Core
Market Segment
Embedded
Market Segment
Workstation
Release Date
Jan 6, 2025
Release Date
Jun 5, 2023

Foundry
TSMC
Foundry
TSMC
Fabrication Node
N3E
Fabrication Node
N5P
Die Size
-
Die Size
971mm²
Transistor Count
-
Transistor Count
134 Billion
Transistor Density
-
Transistor Density
138 MTr/mm²

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