Qualcomm Snapdragon 662 vs Intel Core i3-1115G4 Full Specs
8 Cores(4P+4E) 8 Threads(4P+4E) 2GHz | 2 Cores 4 Threads 2.2GHz |
TDP 5W | TDP 15W |
Bandwidth 14.9GB/s LPDDR4X | Bandwidth 59.7GB/s · |
iGPU | iGPU |
·· 486.4 GFLOPSFP16 | ·· 1.92 TFLOPSFP16 |
Socket - | Socket |
Snapdragon 662331
Core i3-1115G41,6258 Cores 4P 4E | 2 Cores 2P - |
8 Threads 4P 4E | 4 Threads 4P - |
Base Clock 2GHz | Base Clock 2.2GHz |
Boost Clock - | Boost Clock 4.1GHz |
Overclocking Locked | Overclocking Locked |
L1i 32KB P 16KB E | L1i 32KB P - |
L1d 32KB P 16KB E | L1d 48KB P - |
L2 2MB P shared 1MB E shared | L2 1.25MB P - - |
L3 - | L3 6MB |
Type LPDDR4X | Type · |
Max Memory 8GB | Max Memory 32GB |
ECC No | ECC No |
Channels 2 | Channels 2 |
Bus Width 32-bit | Bus Width 128-bit |
Speed 3733MT/s | Speed 3733MT/s |
Bandwidth 14.9GB/s | Bandwidth 59.7GB/s |
Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 14.9GB/s | Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 59.7GB/s |
TDP 5W | TDP 15W |
cTDP-down - | cTDP-down 12W |
cTDP-up - | cTDP-up 28W |
Max Operating Temp - | Max Operating Temp 100°C Max |
Bus Type - | Bus Type OPI |
Bus Config - | Bus Config 8 lanes |
Bus Speed - | Bus Speed 4GT/s |
Bus Bandwidth - | Bus Bandwidth 4GB/s |
- | PCIe PCIe 4.0 x47.9GB/sBandwidth |
iGPU | iGPU |
Shaders 128 | Shaders 384 |
Boost Clock 950MHz | Boost Clock 1.25GHz |
·· 486.4 GFLOPSFP16 | ·· 1.92 TFLOPSFP16 |
NPU Model Hexagon 683 | NPU Model GNA 2.0 |
Modem Model X11 | Modem Model - |
Peak Down Up to 390Mbps | Peak Down - |
Peak Up Up to 150Mbps | Peak Up - |
Controller Model - | Controller Model 500 Series UP3+ |
Codename - | Codename Tiger Lake |
PCIe - | PCIe - |
Manufacturer | Manufacturer |
ISA AArch64 | ISA x86-64 |
Architecture Kryo 260ARMv8.0-A | Architecture |
Family | Family |
Branding  | Branding  |
Codename - - Cortex-A73P-Core Cortex-A53E-Core | Codename Tiger Lake-UP3 Tiger Lake-4C-GT2Variant Willow CoveP-Core - |
Market Segment Smartphone | Market Segment Laptop |
Release Date Jan 20, 2020 | Release Date Sep 2, 2020 |
Foundry Samsung | Foundry Intel |
Other Foundries - | Other Foundries IntelPCH |
Fabrication Node 14LPP - | Fabrication Node 10nm SuperFin 14nmPCH |
Die Size - | Die Size 123mm² 46mm²PCH |
Transistor Count - | Transistor Count 8 Billion |
Transistor Density - | Transistor Density 65 MTr/mm² |
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