Samsung Exynos 7 Octa 7870 vs HiSilicon Kirin 955 Full Specs

Summary

8 Cores 8 Threads 1.6GHz	8 Cores(4P+4E) 8 Threads(4P+4E) 2.5GHz
TDP 5W	TDP 5W
Bandwidth 7.5GB/s LPDDR3	Bandwidth 19.2GB/s LPDDR4·LPDDR3
iGPU Mali-T830 MP1 700MHz	iGPU Mali-T880 MP4 900MHz
Peak·FP32·FP16 14 GFLOPSFP32	Peak·FP32·FP16 72 GFLOPSFP32

Core Config

8 Cores 8P -	8 Cores 4P 4E
8 Threads 8P -	8 Threads 4P 4E

Clocks

Base Clock 1.6GHz	Base Clock 2.5GHz
Overclocking Locked	Overclocking Locked

Cache

L1i -	L1i 32KB P 16KB E
L1d -	L1d 32KB P 16KB E
L2 -	L2 256KB P 128KB E

Memory

Type LPDDR3	Type LPDDR4·LPDDR3
ECC No	ECC No
Channels 1	Channels 2
Bus Width 32-bit	Bus Width 64-bit
Speed 1866MT/s	Speed 2400MT/s
Bandwidth 7.5GB/s	Bandwidth 19.2GB/s
Bandwidth Calculator Channels Transfer Rate1866MT/s UC·Spec·OC 7.5GB/s	Bandwidth Calculator Channels Transfer Rate2400MT/s UC·Spec·OC 19.2GB/s

Power & Thermals

TDP 5W

TDP 5W

iGPU

iGPU Mali-T830 MP1 700MHz	iGPU Mali-T880 MP4 900MHz
Shaders 10	Shaders 40
Boost Clock 700MHz	Boost Clock 900MHz
Peak·FP32·FP16 14 GFLOPSFP32	Peak·FP32·FP16 72 GFLOPSFP32

Cellular

Modem Model Shannon 300/50	Modem Model Balong 720
Peak Down Up to 300Mbps	Peak Down Up to 300Mbps
Peak Up Up to 50Mbps	Peak Up Up to 50Mbps

Chip

Manufacturer Samsung	Manufacturer HiSilicon
ISA AArch64	ISA AArch64
Architecture ARMv8.0-A	Architecture ARMv8.0-A
Branding	Branding
Codename Cortex-A53P-Core -	Codename Cortex-A72P-Core Cortex-A53E-Core
Market Segment Smartphone	Market Segment Smartphone
Release Date Jan 1, 2016	Release Date May 1, 2016

Fabrication

Foundry Samsung	Foundry Samsung
Fabrication Node 28nm LP	Fabrication Node 28nm LP

Images

Competitors

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