Samsung Exynos 7 Octa 7870 vs HiSilicon Kirin 650 Full Specs

Summary

8 Cores 8 Threads 1.6GHz	8 Cores(4P+4E) 8 Threads(4P+4E) 2GHz
TDP 5W	TDP 5W
Bandwidth 7.5GB/s LPDDR3	Bandwidth 14.9GB/s LPDDR3
iGPU Mali-T830 MP1 700MHz	iGPU Mali-T830 MP2 900MHz
Peak·FP32·FP16 14 GFLOPSFP32	Peak·FP32·FP16 36 GFLOPSFP32

Core Config

8 Cores 8P -	8 Cores 4P 4E
8 Threads 8P -	8 Threads 4P 4E

Clocks

Base Clock 1.6GHz	Base Clock 2GHz
Overclocking Locked	Overclocking Locked

Cache

L1i -	L1i 16KB P 16KB E
L1d -	L1d 16KB P 16KB E
L2 - -	L2 128KB E 1MB P shared

Memory

Type LPDDR3	Type LPDDR3
ECC No	ECC No
Channels 1	Channels 2
Bus Width 32-bit	Bus Width 64-bit
Speed 1866MT/s	Speed 1866MT/s
Bandwidth 7.5GB/s	Bandwidth 14.9GB/s
Bandwidth Calculator Channels Transfer Rate1866MT/s UC·Spec·OC 7.5GB/s	Bandwidth Calculator Channels Transfer Rate1866MT/s UC·Spec·OC 14.9GB/s

Power & Thermals

TDP 5W

TDP 5W

iGPU

iGPU Mali-T830 MP1 700MHz	iGPU Mali-T830 MP2 900MHz
Shaders 10	Shaders 20
Boost Clock 700MHz	Boost Clock 900MHz
Peak·FP32·FP16 14 GFLOPSFP32	Peak·FP32·FP16 36 GFLOPSFP32

Cellular

Modem Model Shannon 300/50	Modem Model Balong 720
Peak Down Up to 300Mbps	Peak Down Up to 300Mbps
Peak Up Up to 50Mbps	Peak Up Up to 50Mbps

Chip

Manufacturer Samsung	Manufacturer HiSilicon
ISA AArch64	ISA AArch64
Architecture ARMv8.0-A	Architecture ARMv8.0-A
Branding	Branding
Codename Cortex-A53P-Core -	Codename Cortex-A53P-Core Cortex-A53E-Core
Market Segment Smartphone	Market Segment Smartphone
Release Date Jan 1, 2016	Release Date May 1, 2016

Fabrication

Foundry Samsung	Foundry Samsung
Fabrication Node 28nm LP	Fabrication Node 28nm LP

Images

Competitors

SamsungExynos 7 Octa 7870 vs HiSiliconKirin 650 SamsungExynos 7 Octa 7870 vs CPU HiSiliconKirin 955 SamsungExynos 7 Octa 7870 vs CPU QualcommSnapdragon 652 Show 12 more

HiSiliconKirin 650 vs CPU QualcommSnapdragon 435 HiSiliconKirin 650 vs CPU QualcommSnapdragon 626 HiSiliconKirin 650 vs CPU QualcommSnapdragon 653 Show 12 more