CPUs

Samsung Exynos 9820 vs HiSilicon Kirin 810 Full Specs

8 Cores(2P+2M+4E)
8 Threads(2P+2M+4E)
2.73GHz
8 Cores(2P+6E)
8 Threads(2P+6E)
2.27GHz
TDP
5W
TDP
5W
Bandwidth
33.5GB/s
LPDDR4X
Bandwidth
34.1GB/s
LPDDR4X
iGPU
iGPU
··
808.7 GFLOPSFP16
··
236.2 GFLOPSFP16

8 Cores
2P
2M
4E
8 Cores
2P
-
6E
8 Threads
2P
2M
4E
8 Threads
2P
-
6E

Base Clock
2.73GHz
Base Clock
2.27GHz
Overclocking
Locked
Overclocking
Locked

L1i
-
L1i
64KB P
32KB E
L1d
-
L1d
64KB P
32KB E
L2
-
L2
512KB P
128KB E

Type
LPDDR4X
Type
LPDDR4X
ECC
No
ECC
No
Channels
4
Channels
4
Bus Width
64-bit
Bus Width
64-bit
Speed
4186MT/s
Speed
4266MT/s
Bandwidth
33.5GB/s
Bandwidth
34.1GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
33.5GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
34.1GB/s

TDP
5W
TDP
5W

iGPU
iGPU
Shaders
288
Shaders
72
Boost Clock
702MHz
Boost Clock
820MHz
··
808.7 GFLOPSFP16
··
236.2 GFLOPSFP16

NPU Cores
1
NPU Cores
-

Modem Model
Shannon 5000
Modem Model
Balong 750
Peak Down
Up to 2.0Gbps
Peak Down
Up to 600Mbps
Peak Up
Up to 316Mbps
Peak Up
Up to 150Mbps

Manufacturer
Manufacturer
ISA
AArch64
ISA
AArch64
Architecture
Architecture
Branding
Exynos 9820  branding
Branding
Kirin  branding
Codename
Exynos 9820Variant
Exynos M4 - CheetahP-Core
Cortex-A75M-Core
Cortex-A55E-Core
Codename
-
Cortex-A76P-Core
-
Cortex-A55E-Core
Market Segment
Smartphone
Market Segment
Smartphone
Release Date
Jan 1, 2019
Release Date
May 1, 2019

Foundry
Samsung
Foundry
-
Fabrication Node
8LPP
Fabrication Node
-
Die Size
127mm²
Die Size
-