NVIDIA GeForce RTX 3050 6GB vs AMD Radeon RX 550 Full Specs
2,304 Shaders 1.47GHz | 640 Shaders 1.07GHz |
6GB GDDR6168GB/s | 2GB GDDR596GB/s |
·· 6.77 TFLOPS | ·· 1.37 TFLOPS |
Form Factor PCIe Card | Form Factor PCIe Card |
TDP 70W | TDP 60W |
Clock Speed ··· | Clock Speed ··· |
Peak OPS 216.8 TOPSINT4 Tensor Sparse | Peak OPS 1.37 TFLOPSFP16 |
Tensor FP16-16 27.1 TFLOPSFP16-16 Tensor Sparse 54.19 TFLOPSTensor FP16-32 13.55 TFLOPSFP16-32 Tensor Sparse 27.1 TFLOPS | - |
BF16 6.77 TFLOPSTensor BF16 13.55 TFLOPSBF16 Tensor Sparse 27.1 TFLOPS | - |
Tensor TF32 6.77 TFLOPS | Tensor TF32 - |
FP32 6.77 TFLOPS | FP32 1.37 TFLOPS |
FP64 105.8 GFLOPS | FP64 85.68 GFLOPS |
Tensor INT4 108.4 TOPS | Tensor INT4 - |
Tensor INT8 54.19 TOPS | - |
Ray 10.22 TOPS | Ray - |
Pixel Rate 47 GPixel/s | Pixel Rate 17.1 GPixel/s |
Texture Rate 105.8 GTexel/s | Texture Rate 42.8 GTexel/s |
Shaders 2,304 Shaders | Shaders 640 Shaders |
TMUs 72 TMUs | TMUs 40 TMUs |
ROPs 32 ROPs | ROPs 16 ROPs |
Tensor Cores 72 T-Cores | Tensor Cores - |
RT Cores 18 RT-Cores | RT Cores - |
SMs 18 SMs | CUs 10 CUs |
Base Clock 1.04GHz | Base Clock 1.02GHz |
Boost Clock 1.47GHz | Boost Clock 1.07GHz |
L2 Cache 2MB shared | L2 Cache 1MB shared |
6GB GDDR6 | 2GB GDDR5 |
Memory Bus 96-bit | Memory Bus 128-bit |
Memory Speed 14GT/s | Memory Speed 6GT/s |
Memory Bandwidth 168GB/s | Memory Bandwidth 96GB/s |
ECC No | ECC No |
TDP 70W | TDP 60W |
Multi-Monitor 3 | Multi-Monitor 3 |
HDCP HDCP 2.3 | HDCP HDCP 2.2 |
3x DisplayPort 1.4 | 1x DisplayPort 1.4 |
1x HDMI 2.1 | - |
- | 1x HDMI 2.0 |
- | 1x DVI-D Dual-Link |
Encoder Model NVENC 7 | Encoder Model VCE 3.4 |
Decoder Model NVDEC 5 | Decoder Model UVD 6.3 |
Form Factor PCIe Card | Form Factor PCIe Card |
PCIe 1.9-Slots | PCIe 2-Slots |
Height 112 mm (4.41")Width 242 mm (9.53")Depth 38 mm (1.5") | Height 110 mm (4.33")Width 145 mm (5.71")Depth 37 mm (1.46") |
Cooling Open-Air 2x Fans | Cooling Open-Air 1x Fan |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename NV177 | Codename Baffin |
Chip Variant GA107-140-A1 | Chip Variant Polaris 11 XL |
Market Segment Desktop | Market Segment Desktop |
Release Date Feb 2, 2024 | Release Date Apr 20, 2017 |
Foundry Samsung | Foundry GlobalFoundries |
Fabrication Node 8N | Fabrication Node 14LPP |
Die Size 200mm² | Die Size 123mm² |
Transistor Count 8.7 Billion | Transistor Count 3 Billion |
Transistor Density 43.5 MTr/mm² | Transistor Density 24.39 MTr/mm² |
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