AMD FirePro M5725 vs AMD FirePro M5800 Full Specs
320 Shaders 680MHz | 400 Shaders 650MHz |
262MB GDDR325.6GB/s | 1GB GDDR551.2GB/s |
·· 435.2 GFLOPS | ·· 520 GFLOPS |
Form Factor Soldered | Form Factor Soldered |
TDP 25W | TDP 25W |
FirePro M5725435.2 GFLOPSFP32FirePro M5800520 GFLOPSFP32Clock Speed ·· | Clock Speed ·· |
Peak OPS 435.2 GFLOPSFP32 | Peak OPS 520 GFLOPSFP32 |
FP32 435.2 GFLOPS | FP32 520 GFLOPS |
Pixel Rate 5.4 GPixel/s | Pixel Rate 5.2 GPixel/s |
Texture Rate 21.8 GTexel/s | Texture Rate 13 GTexel/s |
Shaders 320 Shaders | Shaders 400 Shaders |
TMUs 32 TMUs | TMUs 20 TMUs |
ROPs 8 ROPs | ROPs 8 ROPs |
CUs 4 CUs | CUs 5 CUs |
Boost Clock 680MHz | Boost Clock 650MHz |
L2 Cache 256KB shared | L2 Cache 256KB shared |
262MB GDDR3 | 1GB GDDR5 |
Memory Bus 128-bit | Memory Bus 128-bit |
Memory Speed 1.6GT/s | Memory Speed 3.2GT/s |
Memory Bandwidth 25.6GB/s | Memory Bandwidth 51.2GB/s |
TDP 25W | TDP 25W |
Multi-Monitor 2 | Multi-Monitor 2 |
Decoder Model UVD 2.0 | Decoder Model UVD 3.0 |
Form Factor Soldered | Form Factor Soldered |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding  | Branding |
Codename Mario | Codename Redwood |
Chip Variant RV730 Pro | Chip Variant Redwood LE |
Market Segment Laptop | Market Segment Laptop |
Release Date Jan 1, 2009 | Release Date Mar 1, 2010 |
Foundry TSMC | Foundry TSMC |
Fabrication Node 55nm | Fabrication Node 40nm |
Die Size 146mm² | Die Size 104mm² |
Transistor Count 514 Million | Transistor Count 627 Million |
Transistor Density 3.52 MTr/mm² | Transistor Density 6.03 MTr/mm² |
No images available
No images available