AMD FirePro S9100 vs AMD Radeon RX 7700 Full Specs

Summary

2,560 Shaders 824MHz	3,072 Shaders 2.4GHz
12GB GDDR5320GB/s	12GB GDDR6432GB/s
Peak·FP32·FP16 4.22 TFLOPS	Peak·FP32·FP16 29.49 TFLOPS
Form Factor PCIe Card	Form Factor PCIe Card
TDP 225W	TDP 200W
Power Connectors 1x 8-Pin 1x 6-Pin	Power Connectors 1x 8-Pin -

Highlights

Peak OPS

Peak OPS FP32 FP16 Tensor FP16-16 Tensor FP16-32 FP64 BF16 Tensor BF16 Tensor INT8 Tensor INT4 Memory Bandwidth TDP

FirePro S91004.22 TFLOPSFP32

x1

Radeon RX 7700118 TOPSINT4 Tensor

x27.96

Show Top Score

Theoretical Performance

Clock Speed824MHz UC·Boost·OC	Clock Speed2400MHz UC·Base·Boost·OC
Peak OPS 4.22 TFLOPSFP32	Peak OPS 118 TOPSINT4 Tensor
-	Tensor FP16-16 29.49 TFLOPS Tensor FP16-32 29.49 TFLOPS
-	BF16 58.98 TFLOPS Tensor BF16 29.49 TFLOPS
FP32 4.22 TFLOPS	FP32 29.49 TFLOPS
FP64 527.4 GFLOPS	FP64 921.6 GFLOPS
Tensor INT4 -	Tensor INT4 118 TOPS
-	Tensor INT8 29.49 TOPS
Pixel Rate 52.7 GPixel/s	Pixel Rate 230.4 GPixel/s
Texture Rate 131.8 GTexel/s	Texture Rate 460.8 GTexel/s

Core Config

Shaders 2,560 Shaders	Shaders 3,072 Shaders
TMUs 160 TMUs	TMUs 192 TMUs
ROPs 64 ROPs	ROPs 96 ROPs
Tensor Cores -	Tensor Cores 96 T-Cores
RT Cores -	RT Cores 48 RT-Cores
CUs 40 CUs	CUs 48 CUs

Clocks

Base Clock -	Base Clock 1.9GHz
Boost Clock 824MHz	Boost Clock 2.4GHz

Cache

L2 Cache 1MB shared	L2 Cache 4.1MB shared
L3 Cache -	L3 Cache 48MB shared
L3 Bandwidth -	L3 Bandwidth 1.69TB/s

Memory

12GB GDDR5	12GB GDDR6
Memory Bus 512-bit	Memory Bus 192-bit
Memory Speed 5GT/s	Memory Speed 18GT/s
Memory Bandwidth 320GB/s	Memory Bandwidth 432GB/s

Power & Thermals

TDP 225W

TDP 200W

Video Output

Multi-Monitor 3	Multi-Monitor 3
HDCP HDCP 1.4	HDCP HDCP 2.3

Ports

-	3x DisplayPort 2.1
-	1x HDMI 2.1

Encoder

Encoder Model VCE 2.0

Encoder Model VCN 4.0

Decoder

Decoder Model UVD 4.2

Decoder Model VCN 4.0

Card

Form Factor PCIe Card	Form Factor PCIe Card
PCIe 2-Slots	PCIe 2.5-Slots
Height 111 mm (4.37") Width 267 mm (10.51") Depth 37 mm (1.46")	Height 111 mm (4.37") Width 267 mm (10.51") Depth 50 mm (1.97")
Cooling Passive -	Cooling Open-Air 2x Fans
Power Connectors 1x 8-Pin, 1x 6-Pin	Power Connectors 1x 8-Pin

Chip

Manufacturer AMD	Manufacturer AMD
Chip Designer AMD	Chip Designer AMD
Architecture GCN 2	Architecture RDNA 3
Family FirePro S	Family Radeon RX 7000
Branding	Branding
Codename Hawaii	Codename Wheat Nas
Chip Variant Hawaii Pro	Chip Variant Navi 32
Market Segment Server	Market Segment Desktop
Release Date Oct 2, 2014	Release Date Aug 25, 2023

Fabrication

Foundry TSMC	Foundry TSMC
Other Foundries -	Other Foundries TSMCMCD
Fabrication Node 28nm -	Fabrication Node N5 N6MCD
Die Size 438mm² -	Die Size 200mm² 113mm²MCD
Transistor Count 6.2 Billion -	Transistor Count 28.1 Billion 6.2 BillionMCD
Transistor Density 14.16 MTr/mm² -	Transistor Density 140.5 MTr/mm² 54.67 MTr/mm²MCD

Images

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Competitors

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