GPUs

AMD FirePro S9100 vs GIGABYTE GeForce RTX 3050 OC Low Profile 6G Full Specs

2,560 Shaders
824MHz
2,304 Shaders
1.48GHz
12GB GDDR5320GB/s
6GB GDDR6168GB/s
··
4.22 TFLOPS
··
6.81 TFLOPS
Form Factor
PCIe Card
Form Factor
PCIe Card
TDP
225W
TDP
70W
Power Connectors
1x 8-Pin
1x 6-Pin
Power Connectors
-

FirePro S9100FirePro S91004.22 TFLOPSFP32
x1
GeForce RTX 3050 OC Low Profile 6GGeForce RTX 3050 OC Low Profile 6G217.8 TOPSINT4 Tensor Sparse
x51.62

Clock Speed
··
Clock Speed
···
Peak OPS
4.22 TFLOPSFP32
Peak OPS
217.8 TOPSINT4 Tensor Sparse
-
Tensor FP16-16
27.22 TFLOPS
FP16-16 Tensor Sparse
54.45 TFLOPS
Tensor FP16-32
13.61 TFLOPS
FP16-32 Tensor Sparse
27.22 TFLOPS
-
BF16
6.81 TFLOPS
Tensor BF16
13.61 TFLOPS
BF16 Tensor Sparse
27.22 TFLOPS
Tensor TF32
-
Tensor TF32
6.81 TFLOPS
FP32
4.22 TFLOPS
FP32
6.81 TFLOPS
FP64
527.4 GFLOPS
FP64
106.3 GFLOPS
Tensor INT4
-
Tensor INT4
108.9 TOPS
-
Tensor INT8
54.45 TOPS
Ray
-
Ray
10.26 TOPS
Pixel Rate
52.7 GPixel/s
Pixel Rate
47.3 GPixel/s
Texture Rate
131.8 GTexel/s
Texture Rate
106.3 GTexel/s

Shaders
2,560 Shaders
Shaders
2,304 Shaders
TMUs
160 TMUs
TMUs
72 TMUs
ROPs
64 ROPs
ROPs
32 ROPs
Tensor Cores
-
Tensor Cores
72 T-Cores
RT Cores
-
RT Cores
18 RT-Cores
CUs
40 CUs
SMs
18 SMs

Base Clock
-
Base Clock
1.04GHz
Boost Clock
824MHz
Boost Clock
1.48GHz

L2 Cache
1MB shared
L2 Cache
2MB shared

12GB GDDR5
6GB GDDR6
Memory Bus
512-bit
Memory Bus
96-bit
Memory Speed
5GT/s
Memory Speed
14GT/s
Memory Bandwidth
320GB/s
Memory Bandwidth
168GB/s

TDP
225W
TDP
70W

Multi-Monitor
3
Multi-Monitor
3
HDCP
HDCP 1.4
HDCP
HDCP 2.3

-
2x DisplayPort 1.4
-
2x HDMI 2.1

Encoder Model
VCE 2.0
Encoder Model
NVENC 7

Decoder Model
UVD 4.2
Decoder Model
NVDEC 5

Form Factor
PCIe Card
Form Factor
PCIe Card
PCIe
2-Slots
PCIe
1.8-Slots
Height
111 mm (4.37")
Width
267 mm (10.51")
Depth
37 mm (1.46")
Height
69 mm (2.72")
Width
181 mm (7.13")
Depth
36 mm (1.42")
Cooling
Passive
-
Cooling
Open-Air
2x Fans
Power Connectors
1x 8-Pin, 1x 6-Pin
Power Connectors
-

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
FirePro 2014 branding
Branding
GeForce RTX 2018 branding
Codename
Hawaii
Codename
NV177
Chip Variant
Hawaii Pro
Chip Variant
GA107-140-A1
Market Segment
Server
Market Segment
Desktop
Release Date
Oct 2, 2014
Release Date
Feb 2, 2024

Foundry
TSMC
Foundry
Samsung
Fabrication Node
28nm
Fabrication Node
8N
Die Size
438mm²
Die Size
200mm²
Transistor Count
6.2 Billion
Transistor Count
8.7 Billion
Transistor Density
14.16 MTr/mm²
Transistor Density
43.5 MTr/mm²

No images available
No images available