AMD FirePro S9170 vs AMD Radeon AI PRO R9700 Full Specs
2,816 Shaders 930MHz | 4,096 Shaders 2.92GHz |
32GB GDDR5352GB/s | 32GB GDDR6640GB/s |
·· 5.24 TFLOPS | ·· 47.84 TFLOPS |
Form Factor PCIe Card | Form Factor PCIe Card |
TDP 275W | TDP 300W |
Power Connectors - 1x 8-Pin 1x 6-Pin | Power Connectors 1x 12-Pin - - |
Clock Speed ·· | Clock Speed ··· |
Peak OPS 5.24 TFLOPSFP32 | Peak OPS 1.53 POPSINT4 Tensor Sparse |
- | Tensor FP8-16 191.4 TFLOPSFP8-16 Tensor Sparse 382.7 TFLOPSTensor FP8-32 191.4 TFLOPSFP8-32 Tensor Sparse 382.7 TFLOPS |
- | Tensor FP16-16 95.68 TFLOPSFP16-16 Tensor Sparse 191.4 TFLOPSTensor FP16-32 95.68 TFLOPSFP16-32 Tensor Sparse 191.4 TFLOPS |
- | BF16 95.68 TFLOPSTensor BF16 95.68 TFLOPSBF16 Tensor Sparse 191.4 TFLOPS |
FP32 5.24 TFLOPS | FP32 47.84 TFLOPS |
FP64 654.7 GFLOPS | FP64 1.5 TFLOPS |
Tensor INT4 - | Tensor INT4 765.5 TOPS |
- | Tensor INT8 382.7 TOPS |
Pixel Rate 59.5 GPixel/s | Pixel Rate 373.8 GPixel/s |
Texture Rate 163.7 GTexel/s | Texture Rate 747.5 GTexel/s |
Shaders 2,816 Shaders | Shaders 4,096 Shaders |
TMUs 176 TMUs | TMUs 256 TMUs |
ROPs 64 ROPs | ROPs 128 ROPs |
Tensor Cores - | Tensor Cores 128 T-Cores |
RT Cores - | RT Cores 64 RT-Cores |
CUs 44 CUs | CUs 64 CUs |
Base Clock - | Base Clock 2.4GHz |
Boost Clock 930MHz | Boost Clock 2.92GHz |
L2 Cache 1MB shared | L2 Cache 8.2MB shared |
L3 Cache - | L3 Cache 64MB shared |
L3 Bandwidth - | L3 Bandwidth 2.25TB/s |
32GB GDDR5 | 32GB GDDR6 |
Memory Bus 512-bit | Memory Bus 256-bit |
Memory Speed 5.5GT/s | Memory Speed 20GT/s |
Memory Bandwidth 352GB/s | Memory Bandwidth 640GB/s |
TDP 275W | TDP 300W |
Multi-Monitor 3 | Multi-Monitor 3 |
HDCP HDCP 1.4 | HDCP HDCP 2.3 |
- | 3x DisplayPort 2.1 |
- | 1x HDMI 2.1 |
Encoder Model VCE 2.0 | Encoder Model VCN 4.0 |
Decoder Model UVD 4.2 | Decoder Model VCN 4.0 |
Form Factor PCIe Card | Form Factor PCIe Card |
PCIe 2-Slots | PCIe 2-Slots |
Height 111 mm (4.37")Width 267 mm (10.51")Depth 37 mm (1.46") | Height 111 mm (4.37")Width 241 mm (9.49")Depth 40 mm (1.57") |
Cooling Passive - | Cooling Blower 1x Fan |
Power Connectors 1x 8-Pin, 1x 6-Pin | Power Connectors 1x 12-Pin |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename Hawaii | Codename - |
Chip Variant Hawaii Pro | Chip Variant Navi 48 XL |
Market Segment Server | Market Segment Workstation |
Release Date Jul 8, 2015 | Release Date May 20, 2025 |
Foundry TSMC | Foundry TSMC |
Fabrication Node 28nm | Fabrication Node N4P |
Die Size 438mm² | Die Size 357mm² |
Transistor Count 6.2 Billion | Transistor Count 53.9 Billion |
Transistor Density 14.16 MTr/mm² | Transistor Density 151.2 MTr/mm² |
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