AMD FirePro S9170 vs NVIDIA RTX 5000 Ada Full Specs
2,816 Shaders 930MHz | 12,800 Shaders 2.55GHz |
32GB GDDR5352GB/s | 32GB GDDR6576GB/s |
·· 5.24 TFLOPS | ·· 65.28 TFLOPS |
Form Factor PCIe Card | Form Factor PCIe Card |
TDP 275W | TDP 250W |
Power Connectors - 1x 8-Pin 1x 6-Pin | Power Connectors 1x 16-Pin 12VHPWR - - |
Clock Speed ·· | Clock Speed ··· |
Peak OPS 5.24 TFLOPSFP32 | Peak OPS 2.09 POPSINT4 Tensor Sparse |
- | Tensor FP8-16 522.2 TFLOPSFP8-16 Tensor Sparse 1.04 PFLOPSTensor FP8-32 261.1 TFLOPSFP8-32 Tensor Sparse 522.2 TFLOPS |
- | Tensor FP16-16 261.1 TFLOPSFP16-16 Tensor Sparse 522.2 TFLOPSTensor FP16-32 130.6 TFLOPSFP16-32 Tensor Sparse 261.1 TFLOPS |
- | BF16 65.28 TFLOPSTensor BF16 130.6 TFLOPSBF16 Tensor Sparse 261.1 TFLOPS |
Tensor TF32 - | Tensor TF32 65.28 TFLOPS |
FP32 5.24 TFLOPS | FP32 65.28 TFLOPS |
FP64 654.7 GFLOPS | FP64 1.02 TFLOPS |
Tensor INT4 - | Tensor INT4 1.04 POPS |
- | Tensor INT8 522.2 TOPS |
Ray - | Ray 150.9 TOPS |
Pixel Rate 59.5 GPixel/s | Pixel Rate 448.8 GPixel/s |
Texture Rate 163.7 GTexel/s | Texture Rate 1.02 TTexel/s |
Shaders 2,816 Shaders | Shaders 12,800 Shaders |
TMUs 176 TMUs | TMUs 400 TMUs |
ROPs 64 ROPs | ROPs 176 ROPs |
Tensor Cores - | Tensor Cores 400 T-Cores |
RT Cores - | RT Cores 100 RT-Cores |
CUs 44 CUs | SMs 100 SMs |
Base Clock - | Base Clock 1.16GHz |
Boost Clock 930MHz | Boost Clock 2.55GHz |
L2 Cache 1MB shared | L2 Cache 73.7MB shared |
32GB GDDR5 | 32GB GDDR6 |
Memory Bus 512-bit | Memory Bus 256-bit |
Memory Speed 5.5GT/s | Memory Speed 18GT/s |
Memory Bandwidth 352GB/s | Memory Bandwidth 576GB/s |
ECC - | ECC Yes |
TDP 275W | TDP 250W |
Multi-Monitor 3 | Multi-Monitor 4 |
HDCP HDCP 1.4 | HDCP HDCP 2.3 |
- | 4x DisplayPort 1.4 |
Encoder Model VCE 2.0 | Encoder Model 3x NVENC 8 |
Decoder Model UVD 4.2 | Decoder Model 3x NVDEC 5 |
Form Factor PCIe Card | Form Factor PCIe Card |
PCIe 2-Slots | PCIe 2-Slots |
Height 111 mm (4.37")Width 267 mm (10.51")Depth 37 mm (1.46") | Height 112 mm (4.41")Width 267 mm (10.51")Depth 40 mm (1.57") |
Cooling Passive | Cooling Passive |
Power Connectors 1x 8-Pin, 1x 6-Pin | Power Connectors 1x 16-Pin 12VHPWR |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename Hawaii | Codename NV182 |
Chip Variant Hawaii Pro | Chip Variant AD102-200-A1 |
Market Segment Server | Market Segment Workstation |
Release Date Jul 8, 2015 | Release Date Aug 9, 2023 |
Foundry TSMC | Foundry TSMC |
Fabrication Node 28nm | Fabrication Node 4N |
Die Size 438mm² | Die Size 608mm² |
Transistor Count 6.2 Billion | Transistor Count 76.3 Billion |
Transistor Density 14.16 MTr/mm² | Transistor Density 125.4 MTr/mm² |
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