AMD FirePro W600 vs AMD FirePro W9000 Full Specs

Summary

512 Shaders 750MHz	2,048 Shaders 975MHz
2GB GDDR564GB/s	6GB GDDR5264GB/s
Peak·FP32·FP16 768 GFLOPS	Peak·FP32·FP16 3.99 TFLOPS
Form Factor PCIe Card	Form Factor PCIe Card
TDP 75W	TDP 275W
Power Connectors -	Power Connectors 1x 8-Pin 1x 6-Pin

Highlights

Peak OPS

Peak OPS FP32 FP64 Memory Bandwidth TDP

FirePro W600768 GFLOPSFP32

x1

FirePro W90003.99 TFLOPSFP32

x5.20

Show Top Score

Theoretical Performance

Clock Speed750MHz UC·Boost·OC	Clock Speed975MHz UC·Boost·OC
Peak OPS 768 GFLOPSFP32	Peak OPS 3.99 TFLOPSFP32
FP32 768 GFLOPS	FP32 3.99 TFLOPS
FP64 48 GFLOPS	FP64 998.4 GFLOPS
Pixel Rate 12 GPixel/s	Pixel Rate 31.2 GPixel/s
Texture Rate 24 GTexel/s	Texture Rate 124.8 GTexel/s

Core Config

Shaders 512 Shaders	Shaders 2,048 Shaders
TMUs 32 TMUs	TMUs 128 TMUs
ROPs 16 ROPs	ROPs 32 ROPs
CUs 8 CUs	CUs 32 CUs

Clocks

Boost Clock 750MHz

Boost Clock 975MHz

Cache

L2 Cache 256KB shared

L2 Cache 768KB shared

Memory

2GB GDDR5	6GB GDDR5
Memory Bus 128-bit	Memory Bus 384-bit
Memory Speed 4GT/s	Memory Speed 5.5GT/s
Memory Bandwidth 64GB/s	Memory Bandwidth 264GB/s
ECC -	ECC Yes

Power & Thermals

TDP 75W

TDP 275W

Video Output

Multi-Monitor 3

Multi-Monitor 6

Ports

6x Mini DisplayPort 1.2	6x Mini DisplayPort 1.2
-	1x SDI

Encoder

Encoder Model VCE 1.0

Encoder Model VCE 1.0

Decoder

Decoder Model UVD 4.0

Decoder Model UVD 3.2

Card

Form Factor PCIe Card	Form Factor PCIe Card
PCIe 1-Slots	PCIe 2-Slots
Height 111 mm (4.37") Width 168 mm (6.61") Depth 20 mm (0.79")	Height 111 mm (4.37") Width 279 mm (10.98") Depth 37 mm (1.46")
Cooling Blower 1x Fan	Cooling Blower 1x Fan
Power Connectors -	Power Connectors 1x 8-Pin, 1x 6-Pin

Chip

Manufacturer AMD	Manufacturer AMD
Chip Designer AMD	Chip Designer AMD
Architecture GCN 1	Architecture GCN 1
Family FirePro W	Family FirePro W
Branding	Branding
Codename Cape Verde	Codename Tahiti
Chip Variant Cape Verde LE	Chip Variant Tahiti LE
Market Segment Workstation	Market Segment Workstation
Release Date Jun 13, 2012	Release Date Jun 14, 2012

Fabrication

Foundry TSMC	Foundry TSMC
Fabrication Node 28nm	Fabrication Node 28nm
Die Size 123mm²	Die Size 352mm²
Transistor Count 1.5 Billion	Transistor Count 4.3 Billion
Transistor Density 12.2 MTr/mm²	Transistor Density 12.25 MTr/mm²

Images

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