AMD Instinct MI100 vs AMD Instinct MI210 Full Specs

Summary

7,680 Shaders 1.5GHz	6,656 Shaders 1.7GHz
32GB HBM21.23TB/s	64GB HBM2e1.64TB/s
Peak·FP32·FP16 23.07 TFLOPS	Peak·FP32·FP16 22.63 TFLOPS
Form Factor PCIe Card	Form Factor PCIe Card
TDP 300W	TDP 300W
Power Connectors 2x 8-Pin	Power Connectors 1x 8-Pin

Theoretical Performance

Clock Speed1502MHz UC·Base·Boost·OC	Clock Speed1700MHz UC·Base·Boost·OC
Peak OPS 184.6 TFLOPSFP16-16 Tensor	Peak OPS 181 TOPSINT4 Tensor
Tensor FP16-16 184.6 TFLOPS Tensor FP16-32 184.6 TFLOPS	Tensor FP16-16 181 TFLOPS Tensor FP16-32 181 TFLOPS
Tensor BF16 92.28 TFLOPS	Tensor BF16 181 TFLOPS
FP32 23.07 TFLOPS Tensor FP32 46.14 TFLOPS	FP32 22.63 TFLOPS Tensor FP32 45.26 TFLOPS
FP64 11.54 TFLOPS Tensor FP64 -	FP64 22.63 TFLOPS Tensor FP64 45.26 TFLOPS
Tensor INT4 92.28 TOPS	Tensor INT4 181 TOPS
Tensor INT8 92.28 TOPS	Tensor INT8 181 TOPS
Texture Rate 721 GTexel/s	Texture Rate 707.2 GTexel/s

Core Config

Shaders 7,680 Shaders	Shaders 6,656 Shaders
TMUs 480 TMUs	TMUs 416 TMUs
Tensor Cores 480 T-Cores	Tensor Cores 416 T-Cores
CUs 120 CUs	CUs 104 CUs

Clocks

Base Clock 1GHz	Base Clock 1GHz
Boost Clock 1.5GHz	Boost Clock 1.7GHz

Cache

L2 Cache 8MB shared

L2 Cache 8MB shared

Memory

32GB HBM2	64GB HBM2e
Memory Bus 4096-bit	Memory Bus 4096-bit
Memory Speed 2.4GT/s	Memory Speed 3.2GT/s
Memory Bandwidth 1.23TB/s	Memory Bandwidth 1.64TB/s
ECC Yes	ECC Yes

Power & Thermals

TDP 300W

TDP 300W

Encoder

Encoder Model VCN 2.5	Encoder Model VCN 2.6
Codec AVC (H.264) HEVC (H.265)	Codec AVC (H.264) HEVC (H.265)

Decoder

Decoder Model VCN 2.5	Decoder Model VCN 2.6
Codec MPEG-1 MPEG-2 MPEG-4 JPEG VC-1 VP9 AVC (H.264) HEVC (H.265)	Codec -

Card

Form Factor PCIe Card	Form Factor PCIe Card
PCIe 2-Slots	PCIe 2-Slots
Height 111 mm (4.37") Width 267 mm (10.51") Depth 37 mm (1.46")	Height 111 mm (4.37") Width 267 mm (10.51") Depth 37 mm (1.46")
Cooling Passive	Cooling Passive
Power Connectors 2x 8-Pin	Power Connectors 1x 8-Pin

Chip

Manufacturer AMD	Manufacturer AMD
Chip Designer AMD	Chip Designer AMD
Architecture CDNA 1	Architecture CDNA 2
Family Instinct	Family Instinct
Branding	Branding
Codename Arcturus	Codename Aldebaran
Chip Variant Arcturus XL	Chip Variant Aldebaran XL
Market Segment Server	Market Segment Server
Release Date Nov 16, 2020	Release Date Mar 22, 2022

Fabrication

Foundry TSMC	Foundry TSMC
Fabrication Node N7	Fabrication Node N6
Die Size 750mm²	Die Size 724mm²
Transistor Count 25.6 Billion	Transistor Count 28 Billion
Transistor Density 34.13 MTr/mm²	Transistor Density 38.67 MTr/mm²

Images