GPUs

AMD Radeon 760M 2800MHz vs Intel Graphics 2C 1800MHz Full Specs

384 Shaders
2.8GHz
256 Shaders
1.8GHz
Shared Memory83.2GB/sDDR5
Shared Memory102.4GB/sDDR5
··
2.15 TFLOPS
··
921.6 GFLOPS
Form Factor
iGPU
Form Factor
iGPU
TDP
Shared
TDP
Shared

Radeon 760M 2800MHzRadeon 760M 2800MHz4.3 TFLOPSFP16
x2.33
Graphics 2C 1800MHzGraphics 2C 1800MHz1.84 TFLOPSFP16
x1

Clock Speed
···
Clock Speed
··
Peak OPS
4.3 TFLOPSFP16
Peak OPS
1.84 TFLOPSFP16
BF16
4.3 TFLOPS
-
FP32
2.15 TFLOPS
FP32
921.6 GFLOPS
FP64
134.4 GFLOPS
FP64
230.4 GFLOPS
Pixel Rate
44.8 GPixel/s
Pixel Rate
14.4 GPixel/s
Texture Rate
67.2 GTexel/s
Texture Rate
28.8 GTexel/s

Shaders
384 Shaders
Shaders
256 Shaders
TMUs
24 TMUs
TMUs
16 TMUs
ROPs
16 ROPs
ROPs
8 ROPs
RT Cores
6 RT-Cores
RT Cores
2 RT-Cores
CUs
6 CUs
EUs
32 EUs

Base Clock
1.5GHz
Base Clock
-
Boost Clock
2.8GHz
Boost Clock
1.8GHz

L2 Cache
-
L2 Cache
3.1MB shared

Shared MemoryDDR5
Shared MemoryDDR5
Memory Bus
128-bit
Memory Bus
128-bit
Memory Speed
5.2GT/s
Memory Speed
6.4GT/s
Memory Bandwidth
83.2GB/s
Memory Bandwidth
102.4GB/s

Multi-Monitor
4
Multi-Monitor
4
HDCP
HDCP 2.2
HDCP
-

Encoder Model
VCN 4.0
Encoder Model
Arc

Decoder Model
VCN 4.0
Decoder Model
Arc

Form Factor
iGPU
Form Factor
iGPU

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Radeon 2023 branding
Branding
Graphics 2024 branding
Codename
Phoenix
Codename
Xe LPG
Chip Variant
-
Chip Variant
GT1
Market Segment
Laptop
Market Segment
Laptop
Release Date
Jan 8, 2024
Release Date
Dec 14, 2023

Foundry
TSMC
Foundry
TSMC
Fabrication Node
N4
Fabrication Node
N5
Die Size
178mm²
Die Size
23mm²
Transistor Count
25 Billion
Transistor Count
-
Transistor Density
140 MTr/mm²
Transistor Density
-

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