AMD Radeon 8050S vs AMD Radeon RX 7900 XTX Full Specs

Summary

2,048 Shaders 2.8GHz	6,144 Shaders 2.5GHz
Shared Memory256GB/sLPDDR5X	24GB GDDR6960GB/s placeholder
Peak·FP32·FP16 11.47 TFLOPS	Peak·FP32·FP16 61.44 TFLOPS
Form Factor iGPU	Form Factor PCIe Card
TDP Shared	TDP 355W
Power Connectors -	Power Connectors 2x 8-Pin

Highlights

Peak OPS

Peak OPS FP32 FP16 Tensor FP16-16 Tensor FP16-32 FP64 BF16 Tensor BF16 Tensor INT8 Tensor INT4 Memory Bandwidth TDP

Radeon 8050S22.94 TFLOPSFP16

x1

Radeon RX 7900 XTX245.8 TOPSINT4 Tensor

x10.71

Show Top Score

Theoretical Performance

Clock Speed2800MHz UC·Base·Boost·OC	Clock Speed2500MHz UC·Base·Boost·OC
Peak OPS 22.94 TFLOPSFP16	Peak OPS 245.8 TOPSINT4 Tensor
-	Tensor FP16-16 61.44 TFLOPS Tensor FP16-32 61.44 TFLOPS
BF16 22.94 TFLOPS Tensor BF16 -	BF16 122.9 TFLOPS Tensor BF16 61.44 TFLOPS
FP32 11.47 TFLOPS	FP32 61.44 TFLOPS
FP64 716.8 GFLOPS	FP64 1.92 TFLOPS
Tensor INT4 -	Tensor INT4 245.8 TOPS
-	Tensor INT8 61.44 TOPS
Pixel Rate 179.2 GPixel/s	Pixel Rate 480 GPixel/s
Texture Rate 358.4 GTexel/s	Texture Rate 960 GTexel/s

Core Config

Shaders 2,048 Shaders	Shaders 6,144 Shaders
TMUs 128 TMUs	TMUs 384 TMUs
ROPs 64 ROPs	ROPs 192 ROPs
Tensor Cores -	Tensor Cores 192 T-Cores
RT Cores 32 RT-Cores	RT Cores 96 RT-Cores
CUs 32 CUs	CUs 96 CUs

Clocks

Base Clock 1.5GHz	Base Clock 1.9GHz
Boost Clock 2.8GHz	Boost Clock 2.5GHz

Cache

L2 Cache -	L2 Cache 6.1MB shared
L3 Cache -	L3 Cache 96MB shared
L3 Bandwidth -	L3 Bandwidth 3.5TB/s

Memory

Shared MemoryLPDDR5X	24GB GDDR6 placeholder
Memory Bus 256-bit	Memory Bus 384-bit
Memory Speed 8GT/s	Memory Speed 20GT/s
Memory Bandwidth 256GB/s	Memory Bandwidth 960GB/s

Power & Thermals

TDP Shared

TDP 355W

Video Output

Multi-Monitor 4	Multi-Monitor 3
HDCP HDCP 2.3	HDCP HDCP 2.3

Ports

-	2x DisplayPort 2.1
-	1x HDMI 2.1
-	1x USB-C

Encoder

Encoder Model VCN 4.0

Encoder Model VCN 4.0

Decoder

Decoder Model VCN 4.0

Decoder Model VCN 4.0

Card

Form Factor iGPU	Form Factor PCIe Card
PCIe -	PCIe 2.5-Slots
-	Height 135 mm (5.32") Width 287 mm (11.3") Depth 51 mm (2.01")
Cooling Open-Air -	Cooling Open-Air 3x Fans
Power Connectors -	Power Connectors 2x 8-Pin

Chip

Manufacturer AMD	Manufacturer AMD
Chip Designer AMD	Chip Designer AMD
Architecture RDNA 3.5	Architecture RDNA 3
Family 8000	Family Radeon RX 7000
Branding	Branding
Codename Strix Halo	Codename Plum Bonito
Chip Variant -	Chip Variant Navi 31 XL
Market Segment Laptop	Market Segment Desktop
Release Date Jan 6, 2025	Release Date Dec 13, 2022

Fabrication

Foundry TSMC	Foundry TSMC
Other Foundries -	Other Foundries TSMCMCD
Fabrication Node N4X -	Fabrication Node N5 N6MCD
Die Size 141mm² -	Die Size 304mm² 225mm²MCD
Transistor Count 16.6 Billion -	Transistor Count 45.4 Billion 12.3 BillionMCD
Transistor Density 118 MTr/mm² -	Transistor Density 149.2 MTr/mm² 54.67 MTr/mm²MCD

Images

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Used In

CPUs Ryzen AI Max 385 Ryzen AI Max 390 Ryzen AI Max PRO 385 Show 1 more	CPUs -
Desktops Framework Desktop(Early 2025)	Desktops Tinybox Red(Mid 2024)

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