GPUs

AMD Radeon 840M 2900MHz vs Intel Arc 130T 2200MHz Full Specs

256 Shaders
2.9GHz
896 Shaders
2.2GHz
Shared Memory128GB/s
·
Shared Memory134.4GB/s
·
··
1.49 TFLOPS
··
3.94 TFLOPS
Form Factor
iGPU
Form Factor
iGPU
TDP
Shared
TDP
Shared

Clock Speed
···
Clock Speed
··
Peak OPS
2.97 TFLOPSFP16
Peak OPS
7.88 TFLOPSFP16
BF16
2.97 TFLOPS
-
FP32
1.49 TFLOPS
FP32
3.94 TFLOPS
FP64
92.8 GFLOPS
FP64
985.6 GFLOPS
Pixel Rate
92.8 GPixel/s
Pixel Rate
61.6 GPixel/s
Texture Rate
46.4 GTexel/s
Texture Rate
123.2 GTexel/s

Shaders
256 Shaders
Shaders
896 Shaders
TMUs
16 TMUs
TMUs
56 TMUs
ROPs
32 ROPs
ROPs
28 ROPs
RT Cores
4 RT-Cores
RT Cores
7 RT-Cores
CUs
4 CUs
EUs
112 EUs

Base Clock
1.5GHz
Base Clock
-
Boost Clock
2.9GHz
Boost Clock
2.2GHz

L2 Cache
-
L2 Cache
7MB shared

Shared Memory
·
Shared Memory
·
Memory Bus
128-bit
Memory Bus
128-bit
Memory Speed
8GT/s
Memory Speed
8.4GT/s
Memory Bandwidth
128GB/s
Memory Bandwidth
134.4GB/s
ECC
No
ECC
No

Multi-Monitor
4
Multi-Monitor
3
HDCP
HDCP 2.3
HDCP
-

Encoder Model
VCN 4.0
Encoder Model
Xe Media Engine
Codec
VP9
AVC (H.264)
HEVC (H.265)
AV1
Codec
VP9
AVC (H.264)
HEVC (H.265)
AV1

Decoder Model
VCN 4.0
Decoder Model
Xe Media Engine
Codec
MPEG-1
MPEG-2
MPEG-4
JPEG
VC-1
-
VP9
AVC (H.264)
HEVC (H.265)
-
AV1
Codec
-
MPEG-2
-
JPEG
VC-1
VP8
VP9
AVC (H.264)
HEVC (H.265)
VVC (H.266)
AV1

Form Factor
iGPU
Form Factor
iGPU

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Radeon 2023 branding
Branding
Arc branding
Codename
Strix Point
Codename
Xe LPG
Chip Variant
-
Chip Variant
GT1
Market Segment
Laptop
Market Segment
Laptop
Release Date
Jan 6, 2025
Release Date
Sep 3, 2024

Foundry
TSMC
Foundry
TSMC
Fabrication Node
N4P
Fabrication Node
N5
Die Size
233mm²
Die Size
23mm²
Transistor Count
28 Billion
Transistor Count
-
Transistor Density
120 MTr/mm²
Transistor Density
-