AMD Radeon 840M 2900MHz vs Intel Graphics 2C 2300MHz Full Specs

Summary

256 Shaders 2.9GHz	256 Shaders 2.3GHz
Shared Memory128GB/s LPDDR5X·DDR5	Shared Memory119.5GB/s LPDDR5X·DDR5
Peak·FP32·FP16 1.49 TFLOPS	Peak·FP32·FP16 1.18 TFLOPS
Form Factor iGPU	Form Factor iGPU
TDP Shared	TDP Shared

Highlights

Peak OPS

Peak OPS FP32 FP16 Tensor FP16-32 FP64 BF16 Tensor BF16 Tensor INT8 Tensor INT4 Memory Bandwidth

Radeon 840M 2900MHz2.97 TFLOPSFP16

x1

Graphics 2C 2300MHz37.68 TOPSINT4 Tensor

x12.69

Show Top Score

Theoretical Performance

Clock Speed2900MHz UC·Base·Boost·OC	Clock Speed2300MHz UC·Boost·OC
Peak OPS 2.97 TFLOPSFP16	Peak OPS 37.68 TOPSINT4 Tensor
-	Tensor FP16-32 9.42 TFLOPS
BF16 2.97 TFLOPS Tensor BF16 -	BF16 - Tensor BF16 9.42 TFLOPS
FP32 1.49 TFLOPS	FP32 1.18 TFLOPS
FP64 92.8 GFLOPS	FP64 294.4 GFLOPS
Tensor INT4 -	Tensor INT4 37.68 TOPS
-	Tensor INT8 18.84 TOPS
Pixel Rate 92.8 GPixel/s	Pixel Rate 18.4 GPixel/s
Texture Rate 46.4 GTexel/s	Texture Rate 36.8 GTexel/s

Core Config

Shaders 256 Shaders	Shaders 256 Shaders
TMUs 16 TMUs	TMUs 16 TMUs
ROPs 32 ROPs	ROPs 8 ROPs
Tensor Cores -	Tensor Cores 16 T-Cores
RT Cores 4 RT-Cores	RT Cores 2 RT-Cores
CUs 4 CUs	EUs 16 EUs

Clocks

Base Clock 1.5GHz	Base Clock -
Boost Clock 2.9GHz	Boost Clock 2.3GHz

Cache

L2 Cache -

L2 Cache 4.1MB shared

Memory

Shared Memory LPDDR5X·DDR5	Shared Memory LPDDR5X·DDR5
Memory Bus 128-bit	Memory Bus 128-bit
Memory Speed 8GT/s	Memory Speed 7.5GT/s
Memory Bandwidth 128GB/s	Memory Bandwidth 119.5GB/s

Video Output

Multi-Monitor 4	Multi-Monitor 3
HDCP HDCP 2.3	HDCP -

Encoder

Encoder Model VCN 4.0

Encoder Model Xe Media Engine

Decoder

Decoder Model VCN 4.0

Decoder Model Xe Media Engine

Card

Form Factor iGPU

Form Factor iGPU

Chip

Manufacturer AMD	Manufacturer Intel
Chip Designer AMD	Chip Designer Intel
Architecture RDNA 3.5	Architecture Battlemage
Family 800	Family Gen 13
Branding	Branding
Codename Strix Point	Codename Xe3 LPG
Chip Variant -	Chip Variant GT1
Market Segment Laptop	Market Segment Laptop
Release Date Jan 6, 2025	Release Date Jan 5, 2026

Fabrication

Foundry TSMC	Foundry Intel
Fabrication Node N4P	Fabrication Node Intel 3
Die Size 233mm²	Die Size 27mm²
Transistor Count 28 Billion	Transistor Count -
Transistor Density 120 MTr/mm²	Transistor Density -

Images

No images available

No images available

Used In

CPUs Ryzen AI 5 340 Ryzen AI 5 PRO 340	CPUs Core Ultra 5 322 Core Ultra 5 332
Laptops Framework 13(Early 2025)	Laptops -

Competitors

AMDRadeon 840M 2900MHz vs GPU AMDRadeon 860M 3000MHz AMDRadeon 840M 2900MHz vs GPU Apple4-Core A16 AMDRadeon 840M 2900MHz vs GPU Apple4-Core A18 Show 12 more

IntelGraphics 2C 2300MHz vs GPU IntelGraphics 4C 2500MHz IntelGraphics 2C 2300MHz vs GPU IntelArc B390 2500MHz IntelGraphics 2C 2300MHz vs GPU IntelGraphics 4C 2450MHz Show 12 more