AMD Radeon 860M 3000MHz vs Intel Graphics 4C 2450MHz Full Specs

Summary

384 Shaders 3GHz	512 Shaders 2.45GHz
Shared Memory128GB/s LPDDR5X·DDR5	Shared Memory136.5GB/s LPDDR5X·DDR5
Peak·FP32·FP16 2.3 TFLOPS	Peak·FP32·FP16 2.51 TFLOPS
Form Factor iGPU	Form Factor iGPU
TDP Shared	TDP Shared

Highlights

Peak OPS

Peak OPS FP32 FP16 Tensor FP16-32 FP64 BF16 Tensor BF16 Tensor INT8 Tensor INT4 Memory Bandwidth

Radeon 860M 3000MHz4.61 TFLOPSFP16

x1

Graphics 4C 2450MHz80.28 TOPSINT4 Tensor

x17.42

Show Top Score

Theoretical Performance

Clock Speed3000MHz UC·Base·Boost·OC	Clock Speed2450MHz UC·Boost·OC
Peak OPS 4.61 TFLOPSFP16	Peak OPS 80.28 TOPSINT4 Tensor
-	Tensor FP16-32 20.07 TFLOPS
BF16 4.61 TFLOPS Tensor BF16 -	BF16 - Tensor BF16 20.07 TFLOPS
FP32 2.3 TFLOPS	FP32 2.51 TFLOPS
FP64 144 GFLOPS	FP64 627.2 GFLOPS
Tensor INT4 -	Tensor INT4 80.28 TOPS
-	Tensor INT8 40.14 TOPS
Pixel Rate 96 GPixel/s	Pixel Rate 39.2 GPixel/s
Texture Rate 72 GTexel/s	Texture Rate 78.4 GTexel/s

Core Config

Shaders 384 Shaders	Shaders 512 Shaders
TMUs 24 TMUs	TMUs 32 TMUs
ROPs 32 ROPs	ROPs 16 ROPs
Tensor Cores -	Tensor Cores 32 T-Cores
RT Cores 6 RT-Cores	RT Cores 4 RT-Cores
CUs 6 CUs	EUs 32 EUs

Clocks

Base Clock 1.5GHz	Base Clock -
Boost Clock 3GHz	Boost Clock 2.45GHz

Cache

L2 Cache -

L2 Cache 4.1MB shared

Memory

Shared Memory LPDDR5X·DDR5	Shared Memory LPDDR5X·DDR5
Memory Bus 128-bit	Memory Bus 128-bit
Memory Speed 8GT/s	Memory Speed 8.5GT/s
Memory Bandwidth 128GB/s	Memory Bandwidth 136.5GB/s

Video Output

Multi-Monitor 4	Multi-Monitor 3
HDCP HDCP 2.3	HDCP -

Encoder

Encoder Model VCN 4.0

Encoder Model Xe Media Engine

Decoder

Decoder Model VCN 4.0

Decoder Model Xe Media Engine

Card

Form Factor iGPU

Form Factor iGPU

Chip

Manufacturer AMD	Manufacturer Intel
Chip Designer AMD	Chip Designer Intel
Architecture RDNA 3.5	Architecture Battlemage
Family 800	Family Gen 13
Branding	Branding
Codename Strix Point	Codename Xe3 LPG
Chip Variant -	Chip Variant GT1
Market Segment Laptop	Market Segment Laptop
Release Date Jan 6, 2025	Release Date Jan 5, 2026

Fabrication

Foundry TSMC	Foundry Intel
Fabrication Node N4P	Fabrication Node Intel 3
Die Size 233mm²	Die Size 27mm²
Transistor Count 28 Billion	Transistor Count -
Transistor Density 120 MTr/mm²	Transistor Density -

Images

No images available

No images available

Used In

CPUs Ryzen AI 7 350 Ryzen AI 7 PRO 350	CPUs Core Ultra 5 325 Core Ultra 5 335 Core Ultra 7 356H
Laptops Framework 13(Early 2025)	Laptops -

Competitors

AMDRadeon 860M 3000MHz vs GPU AMDRadeon 840M 2900MHz AMDRadeon 860M 3000MHz vs GPU IntelGraphics 4C 2500MHz AMDRadeon 860M 3000MHz vs GPU IntelGraphics 4C 2300MHz Show 12 more

IntelGraphics 4C 2450MHz vs GPU IntelGraphics 4C 2500MHz IntelGraphics 4C 2450MHz vs GPU IntelGraphics 4C 2300MHz IntelGraphics 4C 2450MHz vs GPU IntelArc B390 2500MHz Show 12 more