GPUs

AMD Radeon 890M 2900MHz vs Intel Arc B370 2400MHz Full Specs

1,024 Shaders
2.9GHz
1,280 Shaders
2.4GHz
Shared Memory128GB/s
·
Shared Memory136.5GB/sLPDDR5X
··
5.94 TFLOPS
··
6.14 TFLOPS
Form Factor
iGPU
Form Factor
iGPU
TDP
Shared
TDP
Shared

Radeon 890M 2900MHzRadeon 890M 2900MHz11.88 TFLOPSFP16
x1
Arc B370 2400MHzArc B370 2400MHz196.6 TOPSINT4 Tensor
x16.55

Clock Speed
···
Clock Speed
··
Peak OPS
11.88 TFLOPSFP16
Peak OPS
196.6 TOPSINT4 Tensor
-
Tensor FP16-32
49.15 TFLOPS
BF16
11.88 TFLOPS
Tensor BF16
-
BF16
-
Tensor BF16
49.15 TFLOPS
FP32
5.94 TFLOPS
FP32
6.14 TFLOPS
FP64
371.2 GFLOPS
FP64
1.54 TFLOPS
Tensor INT4
-
Tensor INT4
196.6 TOPS
-
Tensor INT8
98.3 TOPS
Pixel Rate
139.2 GPixel/s
Pixel Rate
96 GPixel/s
Texture Rate
185.6 GTexel/s
Texture Rate
192 GTexel/s

Shaders
1,024 Shaders
Shaders
1,280 Shaders
TMUs
64 TMUs
TMUs
80 TMUs
ROPs
48 ROPs
ROPs
40 ROPs
Tensor Cores
-
Tensor Cores
80 T-Cores
RT Cores
16 RT-Cores
RT Cores
10 RT-Cores
CUs
16 CUs
EUs
80 EUs

Base Clock
1.5GHz
Base Clock
-
Boost Clock
2.9GHz
Boost Clock
2.4GHz

L2 Cache
-
L2 Cache
16.4MB shared

Shared Memory
·
Shared MemoryLPDDR5X
Memory Bus
128-bit
Memory Bus
128-bit
Memory Speed
8GT/s
Memory Speed
8.5GT/s
Memory Bandwidth
128GB/s
Memory Bandwidth
136.5GB/s

Multi-Monitor
4
Multi-Monitor
3
HDCP
HDCP 2.3
HDCP
-

Encoder Model
VCN 4.0
Encoder Model
Xe Media Engine

Decoder Model
VCN 4.0
Decoder Model
Xe Media Engine

Form Factor
iGPU
Form Factor
iGPU

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Radeon 2023 branding
Branding
Arc 2026 branding
Codename
Strix Point
Codename
Xe3 LPG
Chip Variant
-
Chip Variant
GT1
Market Segment
Laptop
Market Segment
Laptop
Release Date
Jun 2, 2024
Release Date
Jan 5, 2026

Foundry
TSMC
Foundry
Intel
Fabrication Node
N4P
Fabrication Node
Intel 3
Die Size
233mm²
Die Size
27mm²
Transistor Count
28 Billion
Transistor Count
-
Transistor Density
120 MTr/mm²
Transistor Density
-

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