AMD Radeon E8870 vs Apple 5-Core A18 Pro Full Specs
768 Shaders 1GHz | 640 Shaders 1.47GHz |
4GB GDDR596GB/s placeholder | Shared Memory60GB/sLPDDR5X |
·· 1.54 TFLOPS | ·· 1.88 TFLOPS |
Form Factor MXM-B | Form Factor iGPU |
TDP 75W | TDP Shared |
Radeon E88701.54 TFLOPSFP32
5-Core A18 Pro1.88 TFLOPSFP16Clock Speed ·· | Clock Speed ·· |
Peak OPS 1.54 TFLOPSFP32 | Peak OPS 1.88 TFLOPSFP16 |
FP32 1.54 TFLOPS | FP32 1.88 TFLOPS |
FP64 96 GFLOPS | - |
Pixel Rate 16 GPixel/s | Pixel Rate 29.4 GPixel/s |
Texture Rate 48 GTexel/s | Texture Rate 58.8 GTexel/s |
Shaders 768 Shaders | Shaders 640 Shaders |
TMUs 48 TMUs | TMUs 40 TMUs |
ROPs 16 ROPs | ROPs 20 ROPs |
RT Cores - | RT Cores 5 RT-Cores |
CUs 12 CUs | EUs 80 EUs |
Boost Clock 1GHz | Boost Clock 1.47GHz |
L2 Cache 256KB shared | L2 Cache 768KB shared |
4GB GDDR5 placeholder | Shared MemoryLPDDR5X |
Memory Bus 128-bit | Memory Bus 64-bit |
Memory Speed 6GT/s | Memory Speed 7.5GT/s |
Memory Bandwidth 96GB/s | Memory Bandwidth 60GB/s |
TDP 75W | TDP Shared |
Multi-Monitor 3 | Multi-Monitor 1 |
HDCP HDCP 1.4 | HDCP - |
Encoder Model VCE 2.0 | Encoder Model Apple Media Engine 3 |
Decoder Model UVD 4.2 | Decoder Model Apple Media Engine 3 |
Form Factor MXM-B | Form Factor iGPU |
Cooling Passive | Cooling Open-Air |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding  | Branding  |
Codename Bonaire | Codename G17P |
Chip Variant Bonaire XT | Chip Variant - |
Market Segment Server | Market Segment Smartphone |
Release Date Sep 1, 2015 | Release Date Mar 4, 2026 |
Foundry TSMC | Foundry TSMC |
Fabrication Node 28nm | Fabrication Node N3E |
Die Size 160mm² | Die Size 110mm² |
Transistor Count 2.1 Billion | Transistor Count 18.4 Billion |
Transistor Density 13 MTr/mm² | Transistor Density 168 MTr/mm² |
No images available
No images available
CPUs - | CPUs |
Laptops - | Laptops |