AMD Radeon E8870 vs Apple 5-Core A19 Pro Full Specs

Summary

768 Shaders 1GHz	640 Shaders 1.47GHz
4GB GDDR596GB/s placeholder	Shared Memory76.8GB/sLPDDR5X
Peak·FP32·FP16 1.54 TFLOPS	Peak·FP32·FP16 1.88 TFLOPS
Form Factor MXM-B	Form Factor iGPU
TDP 75W	TDP Shared

Highlights

Peak OPS

Peak OPS FP32 FP16 Tensor FP8-16 Tensor FP8-32 Tensor FP16-16 Tensor FP16-32 FP64 Memory Bandwidth TDP

Radeon E88701.54 TFLOPSFP32

x1

5-Core A19 Pro3.76 TFLOPSFP8-16 Tensor

x2.45

Show Top Score

Theoretical Performance

Clock Speed1000MHz UC·Boost·OC	Clock Speed1470MHz UC·Boost·OC
Peak OPS 1.54 TFLOPSFP32	Peak OPS 3.76 TFLOPSFP8-16 Tensor
-	Tensor FP8-16 3.76 TFLOPS Tensor FP8-32 3.76 TFLOPS
-	Tensor FP16-16 1.88 TFLOPS Tensor FP16-32 1.88 TFLOPS
FP32 1.54 TFLOPS	FP32 1.88 TFLOPS
FP64 96 GFLOPS	-
Pixel Rate 16 GPixel/s	Pixel Rate 29.4 GPixel/s
Texture Rate 48 GTexel/s	Texture Rate 58.8 GTexel/s

Core Config

Shaders 768 Shaders	Shaders 640 Shaders
TMUs 48 TMUs	TMUs 40 TMUs
ROPs 16 ROPs	ROPs 20 ROPs
Tensor Cores -	Tensor Cores 5 T-Cores
RT Cores -	RT Cores 5 RT-Cores
CUs 12 CUs	EUs 80 EUs

Clocks

Boost Clock 1GHz

Boost Clock 1.47GHz

Cache

L2 Cache 256KB shared

L2 Cache 1MB shared

Memory

4GB GDDR5 placeholder	Shared MemoryLPDDR5X
Memory Bus 128-bit	Memory Bus 64-bit
Memory Speed 6GT/s	Memory Speed 9.6GT/s
Memory Bandwidth 96GB/s	Memory Bandwidth 76.8GB/s

Power & Thermals

TDP 75W

TDP Shared

Video Output

Multi-Monitor 3	Multi-Monitor 1
HDCP HDCP 1.4	HDCP -

Encoder

Encoder Model VCE 2.0

Encoder Model Apple Media Engine 3

Decoder

Decoder Model UVD 4.2

Decoder Model Apple Media Engine 3

Card

Form Factor MXM-B	Form Factor iGPU
Cooling Passive	Cooling Open-Air

Chip

Manufacturer AMD	Manufacturer Apple
Chip Designer AMD	Chip Designer Apple
Architecture GCN 2	Architecture Apple Gen 8
Family Embedded	Family A Series
Branding	Branding
Codename Bonaire	Codename G18P
Chip Variant Bonaire XT	Chip Variant -
Market Segment Server	Market Segment Smartphone
Release Date Sep 1, 2015	Release Date Sep 9, 2025

Fabrication

Foundry TSMC	Foundry TSMC
Fabrication Node 28nm	Fabrication Node N3P
Die Size 160mm²	Die Size 99mm²
Transistor Count 2.1 Billion	Transistor Count 17 Billion
Transistor Density 13 MTr/mm²	Transistor Density 172 MTr/mm²

Images

No images available

No images available

Used In

CPUs -	CPUs A19 Pro (Air)
Smartphones -	Smartphones iPhone Air

Competitors

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