AMD Radeon HD 6250M vs Intel Arc B370 2400MHz Full Specs

Summary

80 Shaders 280MHz	1,280 Shaders 2.4GHz
Shared Memory10.7GB/s DDR3·DDR3L	Shared Memory136.5GB/sLPDDR5X
Peak·FP32·FP16 44.8 GFLOPS	Peak·FP32·FP16 6.14 TFLOPS
Form Factor iGPU	Form Factor iGPU
TDP 9W	TDP Shared

Highlights

Peak OPS

Peak OPS FP32 FP16 Tensor FP16-32 FP64 Tensor BF16 Tensor INT8 Tensor INT4 Memory Bandwidth TDP

Radeon HD 6250M44.8 GFLOPSFP32

x1

Arc B370 2400MHz196.6 TOPSINT4 Tensor

x4388.57

Show Top Score

Theoretical Performance

Clock Speed280MHz UC·Boost·OC	Clock Speed2400MHz UC·Boost·OC
Peak OPS 44.8 GFLOPSFP32	Peak OPS 196.6 TOPSINT4 Tensor
-	Tensor FP16-32 49.15 TFLOPS
-	Tensor BF16 49.15 TFLOPS
FP32 44.8 GFLOPS	FP32 6.14 TFLOPS
-	FP64 1.54 TFLOPS
Tensor INT4 -	Tensor INT4 196.6 TOPS
-	Tensor INT8 98.3 TOPS
Pixel Rate 1.1 GPixel/s	Pixel Rate 96 GPixel/s
Texture Rate 2.2 GTexel/s	Texture Rate 192 GTexel/s

Core Config

Shaders 80 Shaders	Shaders 1,280 Shaders
TMUs 8 TMUs	TMUs 80 TMUs
ROPs 4 ROPs	ROPs 40 ROPs
Tensor Cores -	Tensor Cores 80 T-Cores
RT Cores -	RT Cores 10 RT-Cores
CU 1 CU	EUs 80 EUs

Clocks

Boost Clock 280MHz

Boost Clock 2.4GHz

Cache

L2 Cache 128KB shared

L2 Cache 16.4MB shared

Memory

Shared Memory DDR3·DDR3L	Shared MemoryLPDDR5X
Memory Bus 64-bit	Memory Bus 128-bit
Memory Speed 1.3GT/s	Memory Speed 8.5GT/s
Memory Bandwidth 10.7GB/s	Memory Bandwidth 136.5GB/s
ECC No	ECC No

Power & Thermals

TDP 9W

TDP Shared

Video Output

Multi-Monitor 2

Multi-Monitor 3

Encoder

-	Encoder Model Xe Media Engine

Decoder

Decoder Model UVD 3.0

Decoder Model Xe Media Engine

Card

Form Factor iGPU

Form Factor iGPU

Chip

Manufacturer AMD	Manufacturer Intel
Chip Designer AMD	Chip Designer Intel
Architecture TeraScale 2	Architecture Battlemage
Family Radeon HD 6000	Family Gen 13
Branding	Branding
Codename Wrestler	Codename Xe3 LPG
Chip Variant Loveland	Chip Variant GT1
Market Segment Laptop	Market Segment Laptop
Release Date Nov 9, 2010	Release Date Jan 5, 2026

Fabrication

Foundry TSMC	Foundry Intel
Fabrication Node 40nm	Fabrication Node Intel 3
Die Size 75mm²	Die Size 27mm²
Transistor Count 450 Million	Transistor Count -
Transistor Density 6 MTr/mm²	Transistor Density -

Images

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Used In

CPUs C-30 C-50 G-Series T16R Show 8 more

CPUs Core Ultra 5 338H

Competitors

AMDRadeon HD 6250M vs GPU QualcommAdreno X2-90 7.6T AMDRadeon HD 6250M vs GPU QualcommAdreno X2-90 7T AMDRadeon HD 6250M vs GPU QualcommAdreno X2-85 5.2T Show 3 more

IntelArc B370 2400MHz vs GPU IntelArc B390 2500MHz IntelArc B370 2400MHz vs GPU QualcommAdreno X2-85 5.2T IntelArc B370 2400MHz vs GPU AMDRadeon 8040S Show 12 more