AMD Radeon HD 6410D+ vs Apple 6-Core A19 Pro Full Specs
160 Shaders 600MHz | 768 Shaders 1.62GHz |
Shared Memory25.6GB/sDDR3 | Shared Memory76.8GB/sLPDDR5X |
·· 192 GFLOPS | ·· 2.49 TFLOPS |
Form Factor iGPU | Form Factor iGPU |
TDP Shared | TDP Shared |
Clock Speed ·· | Clock Speed ·· |
Peak OPS 192 GFLOPSFP32 | Peak OPS 4.98 TFLOPSFP8-16 Tensor |
- | Tensor FP8-16 4.98 TFLOPSTensor FP8-32 4.98 TFLOPS |
- | Tensor FP16-16 2.49 TFLOPSTensor FP16-32 2.49 TFLOPS |
FP32 192 GFLOPS | FP32 2.49 TFLOPS |
Pixel Rate 2.4 GPixel/s | Pixel Rate 38.9 GPixel/s |
Texture Rate 4.8 GTexel/s | Texture Rate 77.8 GTexel/s |
Shaders 160 Shaders | Shaders 768 Shaders |
TMUs 8 TMUs | TMUs 48 TMUs |
ROPs 4 ROPs | ROPs 24 ROPs |
Tensor Cores - | Tensor Cores 6 T-Cores |
RT Cores - | RT Cores 6 RT-Cores |
CUs 2 CUs | EUs 96 EUs |
Boost Clock 600MHz | Boost Clock 1.62GHz |
L2 Cache 128KB shared | L2 Cache 1MB shared |
Shared MemoryDDR3 | Shared MemoryLPDDR5X |
Memory Bus 128-bit | Memory Bus 64-bit |
Memory Speed 1.6GT/s | Memory Speed 9.6GT/s |
Memory Bandwidth 25.6GB/s | Memory Bandwidth 76.8GB/s |
Multi-Monitor 2 | Multi-Monitor 1 |
- | Encoder Model Apple Media Engine 3 |
Decoder Model UVD 3.0 | Decoder Model Apple Media Engine 3 |
Form Factor iGPU | Form Factor iGPU |
Cooling Passive | Cooling Open-Air |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename WinterPark | Codename G18P |
Chip Variant SuperSumo | Chip Variant - |
Market Segment Desktop | Market Segment Smartphone |
Release Date Jun 20, 2011 | Release Date Sep 9, 2025 |
Foundry GlobalFoundries | Foundry TSMC |
Fabrication Node 32nm | Fabrication Node N3P |
Die Size 228mm² | Die Size 99mm² |
Transistor Count 1.2 Billion | Transistor Count 17 Billion |
Transistor Density 5 MTr/mm² | Transistor Density 172 MTr/mm² |
No images available
No images available
CPUs | CPUs |
Smartphones - | Smartphones |



