AMD Radeon HD 8400+ vs Intel HD P630 1000MHz Full Specs
128 Shaders 800MHz | 192 Shaders 1GHz |
Shared Memory12.8GB/sDDR3 | Shared Memory38.4GB/s · |
·· 204.8 GFLOPS | ·· 384 GFLOPS |
Form Factor iGPU | Form Factor iGPU |
TDP Shared | TDP Shared |
Clock Speed ·· | Clock Speed ··· |
Peak OPS 204.8 GFLOPSFP32 | Peak OPS 384 GFLOPSFP16 |
FP32 204.8 GFLOPS | FP32 384 GFLOPS |
FP64 12.8 GFLOPS | FP64 96 GFLOPS |
Pixel Rate 3.2 GPixel/s | Pixel Rate 3 GPixel/s |
Texture Rate 6.4 GTexel/s | Texture Rate 24 GTexel/s |
Shaders 128 Shaders | Shaders 192 Shaders |
TMUs 8 TMUs | TMUs 24 TMUs |
ROPs 4 ROPs | ROPs 3 ROPs |
CUs 2 CUs | EUs 24 EUs |
Base Clock - | Base Clock 350MHz |
Boost Clock 800MHz | Boost Clock 1GHz |
L1 16KB/CU | L1 - |
L2 Cache 64KB shared | L2 Cache - |
Shared MemoryDDR3 | Shared Memory · |
Memory Bus 64-bit | Memory Bus 128-bit |
Memory Speed 1.6GT/s | Memory Speed 2.4GT/s |
Memory Bandwidth 12.8GB/s | Memory Bandwidth 38.4GB/s |
ECC No | ECC No |
Max Resolution 4096x2160 | Max Resolution 4096x2304 |
Refresh Rate Calculator 3840x2160 Resolution4K UHD Refresh Rate 64Hz | Refresh Rate Calculator 3840x2160 Resolution4K UHD Refresh Rate 68Hz |
Multi-Monitor 3 | Multi-Monitor 3 |
DSC Not Supported | DSC Not Supported |
Shader Model 6.5 | Shader Model 6.4 |
DirectX DirectX 12Direct3D 12_0 | DirectX DirectX 12Direct3D 12_1 |
OpenGL 4.6OpenCL 2.1Vulkan 1.2 | OpenGL 4.6OpenCL 3Vulkan 1.2 |
GFX 7 | - |
Encoder VCE 2.0 | Encoder Quick Sync Video 6 |
Codec - - AVC (H.264) - | Codec JPEG VP9 AVC (H.264) HEVC (H.265) |
Decoder UVD 4.2 | Decoder Quick Sync Video 6 |
Codec MPEG-1 MPEG-2 MPEG-4 - VC-1 - - AVC (H.264) - | Codec MPEG-1 MPEG-2 MPEG-4 JPEG VC-1 VP8 VP9 AVC (H.264) HEVC (H.265) |
Form Factor iGPU | Form Factor iGPU |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename Kalindi | Codename Kaby Lake |
Chip Variant Kalindi LP | Chip Variant GT1 |
Market Segment Laptop | Market Segment Laptop |
Release Date Nov 23, 2013 | Release Date Aug 5, 2016 |
Foundry TSMC | Foundry Intel |
Fabrication Node 28nm | Fabrication Node 14nm++ |
Die Size 107mm² | Die Size 125mm² |
Transistor Count 914M | Transistor Count 2.1B |
Transistor Density 9 MTr/mm² | Transistor Density 17 MTr/mm² |





