AMD Radeon Pro Duo vs Intel Arc A770M Full Specs

Summary

8,192 Shaders 1GHz	4,096 Shaders 1.65GHz
8GB HBM1.02TB/s	16GB GDDR6512GB/s
Peak·FP32·FP16 16.38 TFLOPS	Peak·FP32·FP16 13.52 TFLOPS
Form Factor PCIe Card	Form Factor Soldered
TDP 350W	TDP 120W
Power Connectors 3x 8-Pin	Power Connectors -

Highlights

Peak OPS

Peak OPS FP32 FP16 Tensor FP16-32 FP64 Tensor BF16 Tensor INT8 Tensor INT4 Memory Bandwidth TDP

Radeon Pro Duo16.38 TFLOPSFP32 (2x 8.19 TFLOPS)

x1

Arc A770M432.5 TOPSINT4 Tensor

x26.40

Show Top Score

Theoretical Performance

Clock Speed1000MHz UC·Boost·OC	Clock Speed1650MHz UC·Base·Boost·OC
Peak OPS 16.38 TFLOPSFP32	Peak OPS 432.5 TOPSINT4 Tensor
-	Tensor FP16-32 108.1 TFLOPS
-	Tensor BF16 108.1 TFLOPS
FP32 16.38 TFLOPS	FP32 13.52 TFLOPS
FP64 1.02 TFLOPS	FP64 3.38 TFLOPS
Tensor INT4 -	Tensor INT4 432.5 TOPS
-	Tensor INT8 216.3 TOPS
Pixel Rate 64 GPixel/s	Pixel Rate 211.2 GPixel/s
Texture Rate 256 GTexel/s	Texture Rate 422.4 GTexel/s

Core Config

Shaders 8,192 Shaders	Shaders 4,096 Shaders
TMUs 512 TMUs	TMUs 256 TMUs
ROPs 128 ROPs	ROPs 128 ROPs
Tensor Cores -	Tensor Cores 512 T-Cores
RT Cores -	RT Cores 32 RT-Cores
CUs 128 CUs	EUs 512 EUs

Clocks

Base Clock -	Base Clock 300MHz
Boost Clock 1GHz	Boost Clock 1.65GHz

Cache

L2 Cache 2MB shared

L2 Cache 8.2MB shared

Memory

8GB HBM	16GB GDDR6
Memory Bus 4096-bit	Memory Bus 256-bit
Memory Speed 1GT/s	Memory Speed 16GT/s
Memory Bandwidth 1.02TB/s	Memory Bandwidth 512GB/s
ECC No	ECC No

Power & Thermals

TDP 350W

TDP 120W

Video Output

Multi-Monitor 4	Multi-Monitor 4
HDCP HDCP 1.4	HDCP -

Ports

3x DisplayPort 1.2	-
1x HDMI 1.4	-

Encoder

Encoder Model VCE 3.0

Encoder Model Arc

Decoder

Decoder Model UVD 6.0

Decoder Model Arc

Card

Form Factor PCIe Card	Form Factor Soldered
PCIe 2-Slots	PCIe -
Height 111 mm (4.37") Width 277 mm (10.91") Depth 40 mm (1.57")	-
Cooling Liquid 120mm Radiator 1x Fan	Cooling Open-Air -
Power Connectors 3x 8-Pin	Power Connectors -

Chip

Manufacturer AMD	Manufacturer Intel
Chip Designer AMD	Chip Designer Intel
Architecture GCN 3	Architecture Alchemist
Family Radeon R 300	Family Arc A
Branding	Branding
Codename Fiji	Codename Xe HPG
Chip Variant Fiji Pro	Chip Variant DG2-512
Market Segment Desktop	Market Segment Laptop
Release Date Apr 26, 2016	Release Date Jun 28, 2022

Fabrication

Foundry TSMC	Foundry TSMC
Fabrication Node 28nm	Fabrication Node N6
Die Size 596mm²	Die Size 406mm²
Transistor Count 8.9 Billion	Transistor Count 21.7 Billion
Transistor Density 14.93 MTr/mm²	Transistor Density 53.45 MTr/mm²

Images

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