AMD Radeon Pro SSG vs NVIDIA GeForce RTX 5070 Laptop 100W Full Specs
4,096 Shaders 1.05GHz | 4,608 Shaders 2.35GHz |
4GB HBM512GB/s | 8GB GDDR7448GB/s |
·· 8.6 TFLOPS | ·· 21.63 TFLOPS |
Form Factor PCIe Card | Form Factor Soldered |
TDP 200W | TDP 100W |
Power Connectors 1x 8-Pin 1x 6-Pin | Power Connectors - |
Clock Speed ·· | Clock Speed ··· |
Peak OPS 8.6 TFLOPSFP32 | Peak OPS 797.7 TFLOPSFP4 Tensor Sparse |
- | Tensor FP4 398.9 TFLOPSFP4 Tensor Sparse 797.7 TFLOPS |
- | Tensor FP8-16 199.4 TFLOPSFP8-16 Tensor Sparse 398.9 TFLOPSTensor FP8-32 99.72 TFLOPSFP8-32 Tensor Sparse 199.4 TFLOPS |
- | Tensor FP16-16 99.72 TFLOPSFP16-16 Tensor Sparse 199.4 TFLOPSTensor FP16-32 49.86 TFLOPSFP16-32 Tensor Sparse 99.72 TFLOPS |
- | BF16 21.63 TFLOPSTensor BF16 49.86 TFLOPSBF16 Tensor Sparse 99.72 TFLOPS |
Tensor TF32 - | Tensor TF32 24.93 TFLOPS |
FP32 8.6 TFLOPS | FP32 21.63 TFLOPS |
FP64 537.6 GFLOPS | FP64 338 GFLOPS |
- | Tensor INT8 199.4 TOPS |
Ray - | Ray 65.6 TOPS |
Pixel Rate 67.2 GPixel/s | Pixel Rate 112.7 GPixel/s |
Texture Rate 268.8 GTexel/s | Texture Rate 338 GTexel/s |
Shaders 4,096 Shaders | Shaders 4,608 Shaders |
TMUs 256 TMUs | TMUs 144 TMUs |
ROPs 64 ROPs | ROPs 48 ROPs |
Tensor Cores - | Tensor Cores 144 T-Cores |
RT Cores - | RT Cores 36 RT-Cores |
CUs 64 CUs | SMs 36 SMs |
Base Clock - | Base Clock 2.07GHz |
Boost Clock 1.05GHz | Boost Clock 2.35GHz |
Tensor Clock - | Tensor Clock 2.71GHz |
L2 Cache 2MB shared | L2 Cache 32.8MB shared |
4GB HBM | 8GB GDDR7 |
Memory Bus 4096-bit | Memory Bus 128-bit |
Memory Speed 1GT/s | Memory Speed 28GT/s |
Memory Bandwidth 512GB/s | Memory Bandwidth 448GB/s |
ECC No | ECC No |
SSG Supported | SSG - |
TDP 200W | TDP 100W |
Multi-Monitor 4 | Multi-Monitor 4 |
HDCP HDCP 1.4 | HDCP HDCP 2.3 |
3x DisplayPort 1.2 | - |
1x HDMI 1.4 | - |
Encoder Model VCE 3.0 | Encoder Model NVENC 9 |
Decoder Model UVD 6.0 | Decoder Model NVDEC 6 |
Form Factor PCIe Card | Form Factor Soldered |
PCIe 2-Slots | PCIe - |
Height 111 mm (4.37")Width 267 mm (10.51")Depth 37 mm (1.46") | - |
Cooling Blower 1x Fan | Cooling Open-Air - |
Power Connectors 1x 8-Pin, 1x 6-Pin | Power Connectors - |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename Fiji | Codename NV196 |
Chip Variant Fiji Pro | Chip Variant - |
Market Segment Workstation | Market Segment Laptop |
Release Date Jul 26, 2016 | Release Date Jan 6, 2025 |
Foundry TSMC | Foundry TSMC |
Fabrication Node 28nm | Fabrication Node 4NP |
Die Size 596mm² | Die Size 183mm² |
Transistor Count 8.9 Billion | Transistor Count 23 Billion |
Transistor Density 14.93 MTr/mm² | Transistor Density 125.7 MTr/mm² |
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