AMD Radeon PRO W5700 vs AMD Radeon PRO W7400 Full Specs
2,304 Shaders 1.88GHz | 1,792 Shaders 1.1GHz |
8GB GDDR6448GB/s | 8GB GDDR6172.8GB/s |
·· 8.66 TFLOPS | ·· 7.88 TFLOPS |
Form Factor PCIe Card | Form Factor PCIe Card |
TDP 205W | TDP 55W |
Radeon PRO W570017.33 TFLOPSFP16
Radeon PRO W740031.54 TOPSINT4 TensorClock Speed ··· | Clock Speed ··· |
Peak OPS 17.33 TFLOPSFP16 | Peak OPS 31.54 TOPSINT4 Tensor |
- | Tensor FP16-16 7.88 TFLOPSTensor FP16-32 7.88 TFLOPS |
- | BF16 15.77 TFLOPSTensor BF16 7.88 TFLOPS |
FP32 8.66 TFLOPS | FP32 7.88 TFLOPS |
FP64 541.4 GFLOPS | FP64 246.4 GFLOPS |
Tensor INT4 - | Tensor INT4 31.54 TOPS |
- | Tensor INT8 7.88 TOPS |
Pixel Rate 120.3 GPixel/s | Pixel Rate 70.4 GPixel/s |
Texture Rate 270.7 GTexel/s | Texture Rate 123.2 GTexel/s |
Shaders 2,304 Shaders | Shaders 1,792 Shaders |
TMUs 144 TMUs | TMUs 112 TMUs |
ROPs 64 ROPs | ROPs 64 ROPs |
Tensor Cores - | Tensor Cores 56 T-Cores |
RT Cores - | RT Cores 28 RT-Cores |
CUs 36 CUs | CUs 28 CUs |
Base Clock 1.4GHz | Base Clock 1GHz |
Boost Clock 1.88GHz | Boost Clock 1.1GHz |
L2 Cache 4.1MB shared | L2 Cache 2MB shared |
L3 Cache - | L3 Cache 32MB shared |
L3 Bandwidth - | L3 Bandwidth 1.17TB/s |
8GB GDDR6 | 8GB GDDR6 |
Memory Bus 256-bit | Memory Bus 128-bit |
Memory Speed 14GT/s | Memory Speed 10.8GT/s |
Memory Bandwidth 448GB/s | Memory Bandwidth 172.8GB/s |
ECC No | ECC No |
TDP 205W | TDP 55W |
Multi-Monitor 4 | Multi-Monitor 3 |
HDCP HDCP 2.3 | HDCP HDCP 2.3 |
- | 4x DisplayPort 2.1 |
5x Mini DisplayPort 1.4 | - |
1x USB-C | - |
Encoder Model VCN 2.0 | Encoder Model VCN 4.0 |
Decoder Model VCN 2.0 | Decoder Model VCN 4.0 |
Form Factor PCIe Card | Form Factor PCIe Card |
PCIe 2-Slots | PCIe 1-Slots |
Height 111 mm (4.37")Width 267 mm (10.51")Depth 37 mm (1.46") | Height 115 mm (4.53")Width 216 mm (8.5")Depth 20 mm (0.79") |
Cooling Blower 1x Fan | Cooling Blower 1x Fan |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding  | Branding  |
Codename Gaming | Codename Hotpink Bonefish |
Chip Variant Navi 10 XE | Chip Variant Navi 33 XL |
Market Segment Workstation | Market Segment Workstation |
Release Date Nov 19, 2019 | Release Date Aug 7, 2025 |
Foundry TSMC | Foundry TSMC |
Fabrication Node N7 | Fabrication Node N6 |
Die Size 251mm² | Die Size 204mm² |
Transistor Count 10.3 Billion | Transistor Count 13.3 Billion |
Transistor Density 41.04 MTr/mm² | Transistor Density 65.2 MTr/mm² |
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