GPUs

AMD Radeon Pro W6500M vs NVIDIA GeForce RTX 3050 Laptop 50W Full Specs

1,024 Shaders
2.59GHz
2,048 Shaders
1.42GHz
4GB GDDR6112GB/s
4GB GDDR6192GB/s
··
5.3 TFLOPS
··
5.8 TFLOPS
Form Factor
Soldered
Form Factor
Soldered
TDP
50W
TDP
50W

Clock Speed
··
Clock Speed
···
Peak OPS
10.6 TFLOPSFP16
Peak OPS
185.7 TOPSINT4 Tensor Sparse
-
Tensor FP16-16
23.22 TFLOPS
FP16-16 Tensor Sparse
46.43 TFLOPS
Tensor FP16-32
11.61 TFLOPS
FP16-32 Tensor Sparse
23.22 TFLOPS
-
BF16
5.8 TFLOPS
Tensor BF16
11.61 TFLOPS
BF16 Tensor Sparse
23.22 TFLOPS
Tensor TF32
-
Tensor TF32
5.8 TFLOPS
FP32
5.3 TFLOPS
FP32
5.8 TFLOPS
FP64
331.3 GFLOPS
FP64
90.69 GFLOPS
Tensor INT4
-
Tensor INT4
92.86 TOPS
-
Tensor INT8
46.43 TOPS
Ray
-
Ray
8.75 TOPS
Pixel Rate
82.8 GPixel/s
Pixel Rate
45.3 GPixel/s
Texture Rate
165.6 GTexel/s
Texture Rate
90.7 GTexel/s

Shaders
1,024 Shaders
Shaders
2,048 Shaders
TMUs
64 TMUs
TMUs
64 TMUs
ROPs
32 ROPs
ROPs
32 ROPs
Tensor Cores
-
Tensor Cores
64 T-Cores
RT Cores
-
RT Cores
16 RT-Cores
CUs
16 CUs
SMs
16 SMs

Base Clock
-
Base Clock
1.19GHz
Boost Clock
2.59GHz
Boost Clock
1.42GHz

L2 Cache
1MB shared
L2 Cache
2MB shared
L3 Cache
16MB shared
L3 Cache
-
L3 Bandwidth
416GB/s
L3 Bandwidth
-

4GB GDDR6
4GB GDDR6
Memory Bus
64-bit
Memory Bus
128-bit
Memory Speed
14GT/s
Memory Speed
12GT/s
Memory Bandwidth
112GB/s
Memory Bandwidth
192GB/s
ECC
No
ECC
No

TDP
50W
TDP
50W

Multi-Monitor
2
Multi-Monitor
3
HDCP
HDCP 2.3
HDCP
HDCP 2.3

-
Encoder Model
NVENC 7
Codec
-
Codec
AVC (H.264)
HEVC (H.265)

Decoder Model
VCN 3.0
Decoder Model
NVDEC 5
Codec
MPEG-1
MPEG-2
MPEG-4
JPEG
VC-1
-
VP9
AVC (H.264)
HEVC (H.265)
AV1
Codec
MPEG-1
MPEG-2
MPEG-4
-
VC-1
VP8
VP9
AVC (H.264)
HEVC (H.265)
AV1

Form Factor
Soldered
Form Factor
Soldered

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Radeon Pro 2020 branding
Branding
GeForce RTX 2018 branding
Codename
Beige Goby
Codename
NV177
Chip Variant
Navi 24 XL
Chip Variant
GA107-140-A1
Market Segment
Laptop
Market Segment
Laptop
Release Date
Jan 19, 2022
Release Date
May 11, 2021

Foundry
TSMC
Foundry
Samsung
Fabrication Node
N6
Fabrication Node
8N
Die Size
107mm²
Die Size
200mm²
Transistor Count
5.4 Billion
Transistor Count
8.7 Billion
Transistor Density
50.47 MTr/mm²
Transistor Density
43.5 MTr/mm²