GPUs

AMD Radeon PRO W7400 vs ATI FireStream 9350 Full Specs

1,792 Shaders
1.1GHz
1,440 Shaders
700MHz
8GB GDDR6172.8GB/s
2GB GDDR5128GB/s
··
7.88 TFLOPS
··
2.02 TFLOPS
Form Factor
PCIe Card
Form Factor
PCIe Card
TDP
55W
TDP
150W
Power Connectors
-
Power Connectors
1x 6-Pin

Radeon PRO W7400Radeon PRO W740031.54 TOPSINT4 Tensor
x15.64
FireStream 9350FireStream 93502.02 TFLOPSFP32
x1

Clock Speed
···
Clock Speed
··
Peak OPS
31.54 TOPSINT4 Tensor
Peak OPS
2.02 TFLOPSFP32
Tensor FP16-16
7.88 TFLOPS
Tensor FP16-32
7.88 TFLOPS
-
BF16
15.77 TFLOPS
Tensor BF16
7.88 TFLOPS
-
FP32
7.88 TFLOPS
FP32
2.02 TFLOPS
FP64
246.4 GFLOPS
FP64
403.2 GFLOPS
Tensor INT4
31.54 TOPS
Tensor INT4
-
Tensor INT8
7.88 TOPS
-
Pixel Rate
70.4 GPixel/s
Pixel Rate
-
Texture Rate
123.2 GTexel/s
Texture Rate
-

Shaders
1,792 Shaders
Shaders
1,440 Shaders
TMUs
112 TMUs
TMUs
-
ROPs
64 ROPs
ROPs
-
Tensor Cores
56 T-Cores
Tensor Cores
-
RT Cores
28 RT-Cores
RT Cores
-
CUs
28 CUs
CUs
18 CUs

Base Clock
1GHz
Base Clock
-
Boost Clock
1.1GHz
Boost Clock
700MHz

L2 Cache
2MB shared
L2 Cache
512KB shared
L3 Cache
32MB shared
L3 Cache
-
L3 Bandwidth
1.17TB/s
L3 Bandwidth
-

8GB GDDR6
2GB GDDR5
Memory Bus
128-bit
Memory Bus
256-bit
Memory Speed
10.8GT/s
Memory Speed
4GT/s
Memory Bandwidth
172.8GB/s
Memory Bandwidth
128GB/s
ECC
No
ECC
No

TDP
55W
TDP
150W

Multi-Monitor
3
Multi-Monitor
6
HDCP
HDCP 2.3
HDCP
-

4x DisplayPort 2.1
-
-
1x DisplayPort 1.1

Encoder Model
VCN 4.0
-

Decoder Model
VCN 4.0
Decoder Model
UVD 2.2

Form Factor
PCIe Card
Form Factor
PCIe Card
PCIe
1-Slots
PCIe
1-Slots
Height
115 mm (4.53")
Width
216 mm (8.5")
Depth
20 mm (0.79")
Height
111 mm (4.37")
Width
241 mm (9.49")
Depth
20 mm (0.79")
Cooling
Blower
1x Fan
Cooling
Passive
-
Power Connectors
-
Power Connectors
1x 6-Pin

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Radeon Pro 2023 branding
Branding
FireStream branding
Codename
Hotpink Bonefish
Codename
Cypress
Chip Variant
Navi 33 XL
Chip Variant
Cypress LE
Market Segment
Workstation
Market Segment
Server
Release Date
Aug 7, 2025
Release Date
Jun 23, 2010

Foundry
TSMC
Foundry
TSMC
Fabrication Node
N6
Fabrication Node
40nm
Die Size
204mm²
Die Size
334mm²
Transistor Count
13.3 Billion
Transistor Count
2.2 Billion
Transistor Density
65.2 MTr/mm²
Transistor Density
6.45 MTr/mm²

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