AMD Radeon PRO W7400 vs Intel Arc A310 Full Specs
1,792 Shaders 1.1GHz | 768 Shaders 1.75GHz |
8GB GDDR6172.8GB/s | 4GB GDDR6124GB/s |
·· 7.88 TFLOPS | ·· 2.69 TFLOPS |
Form Factor PCIe Card | Form Factor PCIe Card |
TDP 55W | TDP 75W |
Radeon PRO W740031.54 TOPSINT4 Tensor
Arc A31086.02 TOPSINT4 TensorClock Speed ··· | Clock Speed ··· |
Peak OPS 31.54 TOPSINT4 Tensor | Peak OPS 86.02 TOPSINT4 Tensor |
Tensor FP16-16 7.88 TFLOPSTensor FP16-32 7.88 TFLOPS | Tensor FP16-16 -Tensor FP16-32 21.5 TFLOPS |
BF16 15.77 TFLOPSTensor BF16 7.88 TFLOPS | BF16 -Tensor BF16 21.5 TFLOPS |
FP32 7.88 TFLOPS | FP32 2.69 TFLOPS |
FP64 246.4 GFLOPS | FP64 672 GFLOPS |
Tensor INT4 31.54 TOPS | Tensor INT4 86.02 TOPS |
Tensor INT8 7.88 TOPS | Tensor INT8 43.01 TOPS |
Pixel Rate 70.4 GPixel/s | Pixel Rate 42 GPixel/s |
Texture Rate 123.2 GTexel/s | Texture Rate 84 GTexel/s |
Shaders 1,792 Shaders | Shaders 768 Shaders |
TMUs 112 TMUs | TMUs 48 TMUs |
ROPs 64 ROPs | ROPs 24 ROPs |
Tensor Cores 56 T-Cores | Tensor Cores 96 T-Cores |
RT Cores 28 RT-Cores | RT Cores 6 RT-Cores |
CUs 28 CUs | EUs 96 EUs |
Base Clock 1GHz | Base Clock 1.75GHz |
Boost Clock 1.1GHz | Boost Clock 1.75GHz |
L2 Cache 2MB shared | L2 Cache 4.1MB shared |
L3 Cache 32MB shared | L3 Cache - |
L3 Bandwidth 1.17TB/s | L3 Bandwidth - |
8GB GDDR6 | 4GB GDDR6 |
Memory Bus 128-bit | Memory Bus 64-bit |
Memory Speed 10.8GT/s | Memory Speed 15.5GT/s |
Memory Bandwidth 172.8GB/s | Memory Bandwidth 124GB/s |
ECC No | ECC No |
TDP 55W | TDP 75W |
Multi-Monitor 3 | Multi-Monitor 4 |
HDCP HDCP 2.3 | HDCP - |
4x DisplayPort 2.1 | - |
- | 4x Mini DisplayPort 2.0 |
Encoder Model VCN 4.0 | Encoder Model Arc |
Decoder Model VCN 4.0 | Decoder Model Arc |
Form Factor PCIe Card | Form Factor PCIe Card |
PCIe 1-Slots | PCIe 1-Slots |
Height 115 mm (4.53")Width 216 mm (8.5")Depth 20 mm (0.79") | Height 69 mm (2.72")Width 168 mm (6.61")Depth 20 mm (0.79") |
Cooling Blower 1x Fan | Cooling Blower 1x Fan |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding  | Branding  |
Codename Hotpink Bonefish | Codename Xe HPG |
Chip Variant Navi 33 XL | Chip Variant DG2-128 |
Market Segment Workstation | Market Segment Desktop |
Release Date Aug 7, 2025 | Release Date Sep 14, 2022 |
Foundry TSMC | Foundry TSMC |
Fabrication Node N6 | Fabrication Node N6 |
Die Size 204mm² | Die Size 157mm² |
Transistor Count 13.3 Billion | Transistor Count 7.2 Billion |
Transistor Density 65.2 MTr/mm² | Transistor Density 45.86 MTr/mm² |
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