AMD Radeon PRO W7500 vs ATI FireMV 2400 PCI Full Specs

Summary

1,792 Shaders 1.7GHz	4 Shaders 500MHz
8GB GDDR6172GB/s	131MB DDR16GB/s
Peak·FP32·FP16 12.19 TFLOPS	Peak·FP32·FP16 -
Form Factor PCIe Card	Form Factor PCI Card
TDP 70W	TDP 20W

Highlights

Peak OPS

Peak OPS FP32 FP16 Tensor FP16-16 Tensor FP16-32 FP64 BF16 Tensor BF16 Tensor INT8 Tensor INT4 Memory Bandwidth TDP

Radeon PRO W750048.74 TOPSINT4 Tensor

x1

FireMV 2400 PCI-

-

Show Top Score

Theoretical Performance

Clock Speed1700MHz UC·Base·Boost·OC	Clock Speed500MHz UC·Boost·OC
Peak OPS 48.74 TOPSINT4 Tensor	Peak OPS -
Tensor FP16-16 12.19 TFLOPS Tensor FP16-32 12.19 TFLOPS	-
BF16 24.37 TFLOPS Tensor BF16 12.19 TFLOPS	-
FP32 12.19 TFLOPS	-
FP64 380.8 GFLOPS	-
Tensor INT4 48.74 TOPS	Tensor INT4 -
Tensor INT8 12.19 TOPS	-
Pixel Rate 108.8 GPixel/s	Pixel Rate 2 GPixel/s
Texture Rate 190.4 GTexel/s	Texture Rate 2 GTexel/s

Core Config

Shaders 1,792 Shaders	Shaders 4 Shaders
TMUs 112 TMUs	TMUs 4 TMUs
ROPs 64 ROPs	ROPs 4 ROPs
Tensor Cores 56 T-Cores	Tensor Cores -
RT Cores 28 RT-Cores	RT Cores -
CUs 28 CUs	Units -

Clocks

Base Clock 1.5GHz	Base Clock -
Boost Clock 1.7GHz	Boost Clock 500MHz

Cache

L2 Cache 2MB shared	L2 Cache -
L3 Cache 32MB shared	L3 Cache -
L3 Bandwidth 1.17TB/s	L3 Bandwidth -

Memory

8GB GDDR6	131MB DDR
Memory Bus 128-bit	Memory Bus 128-bit
Memory Speed 10.8GT/s	Memory Speed 1GT/s
Memory Bandwidth 172GB/s	Memory Bandwidth 16GB/s
ECC No	ECC No

Power & Thermals

TDP 70W

TDP 20W

Video Output

Multi-Monitor 3	Multi-Monitor 4
HDCP HDCP 2.3	HDCP -

Ports

4x DisplayPort 2.1	-
-	2x VHDCI

Encoder

Encoder Model VCN 4.0

-

Decoder

Decoder Model VCN 4.0

-

Card

Form Factor PCIe Card	Form Factor PCI Card
PCIe 1-Slots	PCIe 1-Slots
Height 115 mm (4.53") Width 216 mm (8.5") Depth 20 mm (0.79")	-
Cooling Blower 1x Fan	Cooling Passive -

Chip

Manufacturer AMD	Manufacturer ATI
Chip Designer AMD	Chip Designer ATI
Architecture RDNA 3	Architecture R300
Family Radeon PRO W	Family FireMV
Branding	Branding
Codename Hotpink Bonefish	Codename Vishnu
Chip Variant Navi 33 XL	Chip Variant -
Market Segment Workstation	Market Segment Workstation
Release Date Aug 3, 2023	Release Date Jan 1, 2008

Fabrication

Foundry TSMC	Foundry TSMC
Fabrication Node N6	Fabrication Node 130nm
Die Size 204mm²	Die Size 92mm²
Transistor Count 13.3 Billion	Transistor Count 75 Million
Transistor Density 65.2 MTr/mm²	Transistor Density 0.82 MTr/mm²

Images

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Competitors

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