AMD Radeon PRO W7500 vs ATI FirePro 2460 Multi-View Full Specs
1,792 Shaders 1.7GHz | 80 Shaders 500MHz |
8GB GDDR6172GB/s | 524MB GDDR516GB/s |
·· 12.19 TFLOPS | ·· 80 GFLOPS |
Form Factor PCIe Card | Form Factor PCIe Card |
TDP 70W | TDP 20W |
Radeon PRO W750048.74 TOPSINT4 Tensor
FirePro 2460 Multi-View80 GFLOPSFP32Clock Speed ··· | Clock Speed ·· |
Peak OPS 48.74 TOPSINT4 Tensor | Peak OPS 80 GFLOPSFP32 |
Tensor FP16-16 12.19 TFLOPSTensor FP16-32 12.19 TFLOPS | - |
BF16 24.37 TFLOPSTensor BF16 12.19 TFLOPS | - |
FP32 12.19 TFLOPS | FP32 80 GFLOPS |
FP64 380.8 GFLOPS | - |
Tensor INT4 48.74 TOPS | Tensor INT4 - |
Tensor INT8 12.19 TOPS | - |
Pixel Rate 108.8 GPixel/s | Pixel Rate 2 GPixel/s |
Texture Rate 190.4 GTexel/s | Texture Rate 4 GTexel/s |
Shaders 1,792 Shaders | Shaders 80 Shaders |
TMUs 112 TMUs | TMUs 8 TMUs |
ROPs 64 ROPs | ROPs 4 ROPs |
Tensor Cores 56 T-Cores | Tensor Cores - |
RT Cores 28 RT-Cores | RT Cores - |
CUs 28 CUs | CU 1 CU |
Base Clock 1.5GHz | Base Clock - |
Boost Clock 1.7GHz | Boost Clock 500MHz |
L2 Cache 2MB shared | L2 Cache 128KB shared |
L3 Cache 32MB shared | L3 Cache - |
L3 Bandwidth 1.17TB/s | L3 Bandwidth - |
8GB GDDR6 | 524MB GDDR5 |
Memory Bus 128-bit | Memory Bus 64-bit |
Memory Speed 10.8GT/s | Memory Speed 2GT/s |
Memory Bandwidth 172GB/s | Memory Bandwidth 16GB/s |
ECC No | ECC No |
TDP 70W | TDP 20W |
Multi-Monitor 3 | Multi-Monitor 4 |
HDCP HDCP 2.3 | HDCP - |
4x DisplayPort 2.1 | - |
- | 2x VHDCI |
Encoder Model VCN 4.0 | - |
Decoder Model VCN 4.0 | Decoder Model UVD 2.2 |
Form Factor PCIe Card | Form Factor PCIe Card |
PCIe 1-Slots | PCIe 1-Slots |
Height 115 mm (4.53")Width 216 mm (8.5")Depth 20 mm (0.79") | - |
Cooling Blower 1x Fan | Cooling Open-Air 1x Fan |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding  | Branding  |
Codename Hotpink Bonefish | Codename Cedar |
Chip Variant Navi 33 XL | Chip Variant Cedar Pro |
Market Segment Workstation | Market Segment Workstation |
Release Date Aug 3, 2023 | Release Date Apr 1, 2010 |
Foundry TSMC | Foundry TSMC |
Fabrication Node N6 | Fabrication Node 40nm |
Die Size 204mm² | Die Size 59mm² |
Transistor Count 13.3 Billion | Transistor Count 292 Million |
Transistor Density 65.2 MTr/mm² | Transistor Density 4.95 MTr/mm² |
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