AMD Radeon PRO W7500 vs Intel Arc A770 Full Specs
1,792 Shaders 1.7GHz | 4,096 Shaders 2.4GHz |
8GB GDDR6172GB/s | 8GB GDDR6512GB/s |
·· 12.19 TFLOPS | ·· 19.66 TFLOPS |
Form Factor PCIe Card | Form Factor PCIe Card |
TDP 70W | TDP 225W |
Radeon PRO W750048.74 TOPSINT4 Tensor
Arc A770629.1 TOPSINT4 TensorClock Speed ··· | Clock Speed ··· |
Peak OPS 48.74 TOPSINT4 Tensor | Peak OPS 629.1 TOPSINT4 Tensor |
Tensor FP16-16 12.19 TFLOPSTensor FP16-32 12.19 TFLOPS | Tensor FP16-16 -Tensor FP16-32 157.3 TFLOPS |
BF16 24.37 TFLOPSTensor BF16 12.19 TFLOPS | BF16 -Tensor BF16 157.3 TFLOPS |
FP32 12.19 TFLOPS | FP32 19.66 TFLOPS |
FP64 380.8 GFLOPS | FP64 4.92 TFLOPS |
Tensor INT4 48.74 TOPS | Tensor INT4 629.1 TOPS |
Tensor INT8 12.19 TOPS | Tensor INT8 314.6 TOPS |
Pixel Rate 108.8 GPixel/s | Pixel Rate 307.2 GPixel/s |
Texture Rate 190.4 GTexel/s | Texture Rate 614.4 GTexel/s |
Shaders 1,792 Shaders | Shaders 4,096 Shaders |
TMUs 112 TMUs | TMUs 256 TMUs |
ROPs 64 ROPs | ROPs 128 ROPs |
Tensor Cores 56 T-Cores | Tensor Cores 512 T-Cores |
RT Cores 28 RT-Cores | RT Cores 32 RT-Cores |
CUs 28 CUs | EUs 512 EUs |
Base Clock 1.5GHz | Base Clock 2.1GHz |
Boost Clock 1.7GHz | Boost Clock 2.4GHz |
L2 Cache 2MB shared | L2 Cache 8.2MB shared |
L3 Cache 32MB shared | L3 Cache - |
L3 Bandwidth 1.17TB/s | L3 Bandwidth - |
8GB GDDR6 | 8GB GDDR6 |
Memory Bus 128-bit | Memory Bus 256-bit |
Memory Speed 10.8GT/s | Memory Speed 16GT/s |
Memory Bandwidth 172GB/s | Memory Bandwidth 512GB/s |
TDP 70W | TDP 225W |
Multi-Monitor 3 | Multi-Monitor 4 |
HDCP HDCP 2.3 | HDCP - |
4x DisplayPort 2.1 | - |
- | 3x DisplayPort 2.0 |
- | 1x HDMI 2.1 |
Encoder Model VCN 4.0 | Encoder Model Arc |
Decoder Model VCN 4.0 | Decoder Model Arc |
Form Factor PCIe Card | Form Factor PCIe Card |
PCIe 1-Slots | PCIe 2-Slots |
Height 115 mm (4.53")Width 216 mm (8.5")Depth 20 mm (0.79") | Height 98.4 mm (3.87")Width 279.9 mm (11.02")Depth 40 mm (1.57") |
Cooling Blower 1x Fan | Cooling Open-Air 2x Fans |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding  | Branding  |
Codename Hotpink Bonefish | Codename Xe HPG |
Chip Variant Navi 33 XL | Chip Variant DG2-512 |
Market Segment Workstation | Market Segment Desktop |
Release Date Aug 3, 2023 | Release Date Oct 14, 2022 |
Foundry TSMC | Foundry TSMC |
Fabrication Node N6 | Fabrication Node N6 |
Die Size 204mm² | Die Size 406mm² |
Transistor Count 13.3 Billion | Transistor Count 21.7 Billion |
Transistor Density 65.2 MTr/mm² | Transistor Density 53.45 MTr/mm² |
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